公开(公告)号：US20190014661A1

公开(公告)日：2019-01-10

申请号：US16069687

申请日：2017-01-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUKI INOUE ,  TATSUYA ARISAWA ,  YUKI KITAI

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  C08J5/24 ,  C08G59/22 ,  C08G59/24 ,  C08G59/40

Abstract: The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 μm or less.

公开(公告)号：US20190270280A1

公开(公告)日：2019-09-05

申请号：US16071071

申请日：2016-12-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TATSUYA ARISAWA ,  TOMOYUKI ABE ,  SHUNJI ARAKI ,  YUKI INOUE

IPC: B32B15/092 ,  B32B37/18 ,  H05K1/03 ,  H05K1/09

Abstract: A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz.

公开(公告)号：US20170099731A1

公开(公告)日：2017-04-06

申请号：US15128093

申请日：2015-04-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TATSUYA ARISAWA ,  YOSHIHIKO NAKAMURA ,  TOMOYUKI ABE ,  KIYOTAKA KOMORI ,  SYOUJI HASIMOTO ,  MITSUYOSHI NISHINO

IPC: H05K1/03 ,  C08J5/24 ,  H05K3/00 ,  B32B15/08 ,  B32B27/20

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2371/12 ,  H05K1/0366 ,  H05K3/0067 ,  H05K2201/0209 ,  H05K2201/0215

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.