公开(公告)号：US20230269869A1

公开(公告)日：2023-08-24

申请号：US18170976

申请日：2023-02-17

Applicant: PanelSemi Corporation

Inventor： YI-HUA WU

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K2201/051 ,  H05K2201/10128

Abstract: A resilient substrate structure, which can be rolled up around an axis, includes a substrate, a working patterned layer and a resilient structure. The substrate has a first surface and a second surface. The substrate is defined with a first edge and a second edge in a direction parallel to the axis. The working patterned layer is arranged on the substrate. The resilient structure is arranged on the second surface. The resilient structure includes a composite layer and a supporting layer, which keep attaching to each other. The composite layer has curve-able segments, each of which is parallel to the axis and connects to the first and second edges. The resilient structure is transformed to contain multiple wavy segments when the resilient substrate structure is at the retraction state. An electronic device including the resilient substrate structure and electronic elements is also disclosed.