公开(公告)号：US20230369555A1

公开(公告)日：2023-11-16

申请号：US18316706

申请日：2023-05-12

Applicant: PanelSemi Corporation

Inventor： Yi-Hua WU ,  Chin-Tang LI

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: An electronic device includes a substrate, a trace layer and a plurality of electronic components. The substrate defines a thickness less than or equal to 100 µm. The substrate further defines a plurality of transmittances, and at least one of the transmittances is greater than 20% under the condition of the wavelength of light being between 500 nm and 1300 nm. The trace layer is arranged on the substrate, and the trace layer includes a plurality of connection pads. The electronic components are arranged on the substrate. Each electronic component is provided with at least one electrode, which is arranged on a face of the electronic component facing the substrate. At least one electrode of each electronic component is eutectic bonded to one of the connection pads.