公开(公告)号：US20230039400A1

公开(公告)日：2023-02-09

申请号：US17882329

申请日：2022-08-05

Applicant: PanelSemi Corporation

Inventor： Chin-Tang LI

IPC: H01L25/16 ,  H01L33/46 ,  H01L33/22

Abstract: A display device includes a display module and a light-shielding structure. The display module has a substrate, a plurality of photoelectric units and a protective layer. The substrate defines with a first surface and a second surface. The photoelectric units are arranged on the first surface of the substrate, and each photoelectric unit has at least one photoelectric element. The protective layer is arranged on the first surface of the substrate and is filled between the photoelectric elements. The light-shielding structure is arranged on and connected to the protective layer. The light-shielding structure has a light-shielding layer including light-absorption materials and a plurality of windows defined in the light-shielding layer. The windows respectively correspond to the photoelectric units, and the photoelectric units are viewed through the corresponding windows in the direction perpendicular to the first surface of the substrate.

公开(公告)号：US20240098890A1

公开(公告)日：2024-03-21

申请号：US18368741

申请日：2023-09-15

Applicant: PanelSemi Corporation

Inventor： Chao-Jung CHEN ,  Chin-Tang LI

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H05K1/144 ,  H05K1/147 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10189

Abstract: An electronic device and an electronic apparatus with a mating structure. The electronic device comprises a first substrate with a first face and a second face opposite to each other, a plural of tiles on the first face and with a second substrate and a patterned layer, a trace layer between the tiles and the first substrates and electrically connected to the patterned layer, and a connection component disposed at a second surface of the first substrate and electrically connected to the trace layer.

公开(公告)号：US20240170467A1

公开(公告)日：2024-05-23

申请号：US18427303

申请日：2024-01-30

Applicant: PanelSemi Corporation

Inventor： Chin-Tang LI ,  Ting-Yen LIN ,  Chen-Hsun YANG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L25/0753 ,  H01L33/62

Abstract: An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, and multiple signal layers. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units.

公开(公告)号：US20240098896A1

公开(公告)日：2024-03-21

申请号：US18463728

申请日：2023-09-08

Applicant: PanelSemi Corporation

Inventor： Chin-Tang LI ,  Chao-Jung CHEN

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/0939 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09854

Abstract: An electronic device includes a first substrate, a second substrate, plural conductive pads, plural hole structures, plural connection pads and plural conductive structures. Hole structures penetrate through the first and second substrates, and are arranged corresponding to the conductive pads. Second ends of hole structures are located at the second substrate, and the corresponding conductive pad is exposed by one of the second ends. Connection pads enclose first ends of hole structures. Conductive structures are arranged in the hole structures and electrically connected to corresponding conductive pads and connection pads. The second diameter portion of each conductive structure penetrates through first substrate and conductive pad and is electrically connected to corresponding connection pad and conductive pad, and first diameter portion thereof penetrates through second substrate and is electrically connected to corresponding conductive pad. Each conductive pad defines an opening, which is exposed by second end of corresponding hole structure.

公开(公告)号：US20250105113A1

公开(公告)日：2025-03-27

申请号：US18899765

申请日：2024-09-27

Applicant: PanelSemi Corporation

Inventor： Tang-Chin HUNG ,  Chin-Tang LI ,  Hsien-Te CHEN

IPC: H01L23/498 ,  H01L23/15

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a redistribution structure configured with a redistribution layer trace; a substrate configured with a substrate trace facing the redistribution structure; an adhesion layer attaching the redistribution structure to the substrate; and a plurality of conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate.

公开(公告)号：US20230318184A1

公开(公告)日：2023-10-05

申请号：US18194160

申请日：2023-03-31

Applicant: PanelSemi Corporation

Inventor： Chin-Tang LI

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/48

CPC classification number: H01Q9/0407 ,  H01Q1/22 ,  H01Q1/48

Abstract: An antenna device includes a first substrate, an antenna element, a second substrate, a circuitry, and one or more conductive structures. The antenna element is arranged on one surface of the first substrate, and the second substrate is arranged on another surface of the first substrate. The conductive structure defines a through hole at least penetrating through the second substrate and a conductive member arranged in the through hole. At least some of the conductive structures are electrically connected to the antenna element and the circuitry, and the antenna elements are electrically connected to corresponding electronic elements.

公开(公告)号：US20250120237A1

公开(公告)日：2025-04-10

申请号：US18984307

申请日：2024-12-17

Applicant: PanelSemi Corporation

Inventor： Chin-Tang LI ,  Ting-Yen LIN ,  Chen-Hsun YANG

IPC: H10H29/49

Abstract: An electronic device includes a sustaining layer, a substrate, a plurality of photoelectric units, and a plurality of signal layers. The substrate is arranged on a contact surface of the sustaining layer. A first end edge of the substrate approaches a first end edge of the sustaining layer, and a second end edge of the substrate approaches a second end edge of the sustaining layer. The sustaining layer and the substrate are arranged in one on one manner. The photoelectric units are arranged on a first surface or/and a second surface of the substrate. The signal layers are arranged on the substrate and electrically connected to the photoelectric units.

公开(公告)号：US20250105118A1

公开(公告)日：2025-03-27

申请号：US18899738

申请日：2024-09-27

Applicant: PanelSemi Corporation

Inventor： Tang-Chin HUNG ,  Chin-Tang LI ,  Hsien-Te CHEN

IPC: H01L23/498 ,  H01L21/48 ,  H01L27/12

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a redistribution structure configured with a redistribution layer trace; a substrate configured with a substrate trace facing the redistribution structure; an adhesion layer attaching the redistribution structure to the substrate; and a plurality of conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate.

公开(公告)号：US20240090129A1

公开(公告)日：2024-03-14

申请号：US18463420

申请日：2023-09-08

Applicant: PanelSemi Corporation

Inventor： Chin-Tang LI ,  Chao-Jung CHEN

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K2201/09236 ,  H05K2201/09509

Abstract: An electronic device includes a first substrate and a second substrate stacked on each other, a plurality of pad groups, a plurality of channels, and a plurality of conductive members. The first substrate and the second substrate respectively have an inner surface facing to each other and an outer surface away from each other. Each pad group includes two conductive pads, which are respectively disposed at the outer surfaces of the first substrate and the second substrate and are located corresponding to each other. The channels pass through the first substrate and the second substrate, and each channel is disposed corresponding to one of the pad groups. Two ends of each channel are respectively sealed by the two conductive pads of the corresponding pad group. The conductive members are disposed in the channels, and each conductive member is electrically connected to the two conductive pads of the corresponding pad group.

公开(公告)号：US20230369555A1

公开(公告)日：2023-11-16

申请号：US18316706

申请日：2023-05-12

Applicant: PanelSemi Corporation

Inventor： Yi-Hua WU ,  Chin-Tang LI

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: An electronic device includes a substrate, a trace layer and a plurality of electronic components. The substrate defines a thickness less than or equal to 100 µm. The substrate further defines a plurality of transmittances, and at least one of the transmittances is greater than 20% under the condition of the wavelength of light being between 500 nm and 1300 nm. The trace layer is arranged on the substrate, and the trace layer includes a plurality of connection pads. The electronic components are arranged on the substrate. Each electronic component is provided with at least one electrode, which is arranged on a face of the electronic component facing the substrate. At least one electrode of each electronic component is eutectic bonded to one of the connection pads.