Abstract:
A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.
Abstract:
There is described an inspection system for inspecting an object, the system comprising: a structural inspection module for inspecting the object structurally; a functional test module for testing the object functionally; a support device for supporting the object to be inspected structurally and tested functionally; and a common controller for the structural inspection module and the functional test module. A method for use with the system is also described.