公开(公告)号：US20040028113A1

公开(公告)日：2004-02-12

申请号：US10419709

申请日：2003-04-18

Applicant: Photon Dynamics, Inc.

Inventor： Jerry Schlagheck ,  Marc Pastor ,  Marc Levesque ,  Alain Cournoyer

IPC: G01N017/00

CPC classification number: G01N25/72

Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.

Abstract translation: 教导了一种检测物体和检测缺陷的方法（特别是PCB上的BGA和Flip-Chip焊点）。 该方法包括在物体上注入热刺激; 捕获对象的连续红外图像的序列，以记录由热脉冲引起的热扩散; 将所述物体上的热扩散与参考进行比较; 并确定对象是否包含任何缺陷。 还描述了一种包括用于安装物体的安装件的系统; 用于将热刺激施加到所述物体的底表面的热刺激模块; 用于捕获物体顶表面上的物体的红外图像以记录由热刺激产生的来自顶表面的红外辐射的变化的红外相机; 以及用于将顶表面上的区域中的红外辐射的变化与参考进行比较并确定对象是否包括任何缺陷的计算机。