MICRO LIGHT-EMITTING ELEMENT AND MICRO LIGHT-EMITTING ELEMENT DISPLAY DEVICE

    公开(公告)号:US20240113261A1

    公开(公告)日:2024-04-04

    申请号:US17974560

    申请日:2022-10-27

    CPC classification number: H01L33/382 H01L25/0753 H01L33/62

    Abstract: A micro light-emitting element including an epitaxial structure, an insulating layer, an electrode structure and a sacrificial layer is provided. The epitaxial structure includes a top surface and a side surface. The insulating layer is disposed on the top surface and the side surface of the epitaxial structure, and the insulating layer includes an opening. The electrode structure is disposed on the top surface of the epitaxial structure and extends through the opening of the insulating layer to be electrically connected to the epitaxial structure. The sacrificial layer is sandwiched between a surface of the insulating layer and the corresponding electrode structure. A micro light-emitting element display device is further provided.

    MICRO LIGHT-EMITTING DEVICE AND MICRO LIGHT-EMITTING DEVICE STRUCTURE

    公开(公告)号:US20240413277A1

    公开(公告)日:2024-12-12

    申请号:US18353114

    申请日:2023-07-17

    Abstract: A micro light-emitting device includes an epitaxial structure, a first electrode, a second electrode, a first contact layer and a diffusion structure. The epitaxial structure includes a first-type semiconductor layer, an active layer and a second-type semiconductor layer stacked in sequence. The second-type semiconductor layer has an outer surface relatively away from the first-type semiconductor layer. The first and second electrodes are respectively disposed on the epitaxial structure and electrically connected to the first-type and the second-type semiconductor layers. The first contact layer is disposed between the first electrode and the first-type semiconductor layer. The diffusion structure is disposed on a side of the second-type semiconductor layer away from the first-type semiconductor layer. A conductivity of the diffusion structure is less than that of the second-type semiconductor layer. The outer surface of the second-type semiconductor layer exposes a lower surface of the diffusion structure away from the first-type semiconductor layer.

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