公开(公告)号：US10079222B2

公开(公告)日：2018-09-18

申请号：US15353721

申请日：2016-11-16

Applicant: Powertech Technology Inc.

Inventor： Chien-Wei Chou ,  Yong-Cheng Chuang

IPC: H01L23/48 ,  H01L25/065 ,  H05K1/18 ,  H05K1/11 ,  H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H05K1/02

CPC classification number: H01L25/0657 ,  H01L21/4821 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.

公开(公告)号：US20180138149A1

公开(公告)日：2018-05-17

申请号：US15353721

申请日：2016-11-16

Applicant: Powertech Technology Inc.

Inventor： Chien-Wei Chou ,  Yong-Cheng Chuang

IPC: H01L25/065 ,  H05K1/18 ,  H05K1/11 ,  H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H05K1/02

CPC classification number: H01L25/0657 ,  H01L21/4821 ,  H01L23/3128 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/181 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.