公开(公告)号：US20160240393A1

公开(公告)日：2016-08-18

申请号：US14623509

申请日：2015-02-17

Applicant: Powertech Technology inc.

Inventor： Hung-Chieh Huang

IPC: H01L21/56 ,  H01L21/66

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L22/12 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125

Abstract: A processing machine of an underfill process comprises a carrier, an automated device, a scanning mechanism, an identifying device and a host. The carrier is suitable for carrying a package substrate provided with chips bonded thereon. The automated device has a dispenser for filling an underfill between each chip and the package substrate. The scanning mechanism is configured on the carrier, and the identifying device is driven by the scanning mechanism to move along a predetermined path over the package substrate and identify positions of the chips before the dispenser fills the underfill between each chip and the package substrate. The identifying device is suitable for outputting an identifying result of chip position, and a movement of the identifying device is independent from a movement of the dispenser. The host receives the identifying result and locates the dispenser of the automated device according to the identifying result.

Abstract translation: 底部填充处理的处理机包括载体，自动化装置，扫描机构，识别装置和主机。 载体适用于承载提供有键合在其上的芯片的封装基板。 自动化装置具有用于在每个芯片和封装基板之间填充底部填充物的分配器。 扫描机构配置在载体上，识别装置由扫描机构驱动，沿着预定路径移动到封装基板上，并在分配器填充每个芯片与封装基板之间的底部填充物之前识别芯片的位置。 识别装置适于输出芯片位置的识别结果，并且识别装置的移动与分配器的运动无关。 主机接收识别结果，并根据识别结果定位自动化设备的分配器。

公开(公告)号：US09653325B2

公开(公告)日：2017-05-16

申请号：US14623509

申请日：2015-02-17

Applicant: Powertech Technology Inc.

Inventor： Hung-Chieh Huang

IPC: H01L21/56 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L22/12 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125

Abstract: A processing machine of an underfill process comprises a carrier, an automated device, a scanning mechanism, an identifying device and a host. The carrier is suitable for carrying a package substrate provided with chips bonded thereon. The automated device has a dispenser for filling an underfill between each chip and the package substrate. The scanning mechanism is configured on the carrier, and the identifying device is driven by the scanning mechanism to move along a predetermined path over the package substrate and identify positions of the chips before the dispenser fills the underfill between each chip and the package substrate. The identifying device is suitable for outputting an identifying result of chip position, and a movement of the identifying device is independent from a movement of the dispenser. The host receives the identifying result and locates the dispenser of the automated device according to the identifying result.

公开(公告)号：US20190247944A1

公开(公告)日：2019-08-15

申请号：US15893684

申请日：2018-02-11

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Kun-Chi Hsu ,  Sheng-Tou Tseng ,  Hung-Chieh Huang

IPC: B23K1/20 ,  B23K3/08

CPC classification number: B23K1/203 ,  B23K1/0016 ,  B23K3/082 ,  B23K2101/40 ,  H05K3/3489

Abstract: A flux transfer tool includes a frame, a plunger, a baseplate, a flux supplier and a driving mechanism. The frame has a chamber. The plunger is movably disposed in the chamber. The baseplate is mounted on the frame. The baseplate has a plurality of holes formed thereon. The flux supplier is connected to the frame and contains a flux. The flux supplier supplies the flux to the chamber between the plunger and the baseplate. The driving mechanism is disposed on the frame. The driving mechanism drives the plunger to move towards the baseplate to squeeze the flux out of the holes of the baseplate. The driving mechanism drives the plunger to move away from the baseplate to keep the flux in the chamber.

公开(公告)号：US20190275600A1

公开(公告)日：2019-09-12

申请号：US15915003

申请日：2018-03-07

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Kun-Chi Hsu ,  Sheng-Tou Tseng ,  Hung-Chieh Huang

IPC: B23K1/20 ,  H05K1/14 ,  H01L21/56 ,  H05K3/34 ,  H01L21/48 ,  H01L23/13 ,  H01L23/492 ,  H01L23/00

Abstract: A flux transfer tool includes a flux tray, a baseplate, a flux transfer head and a flexible member. The baseplate is disposed on the flux tray. The baseplate has a plurality of holes formed thereon. The flux transfer head is arranged corresponding to the flux tray and configured to move with respect to the flux tray. The flexible member is disposed on the flux transfer head. The flexible member faces the baseplate when the flux transfer head is located above the flux tray. When the holes are filled with a flux, the flux transfer head moves towards the flux tray, such that the flexible member adsorbs the flux from the holes.

公开(公告)号：US20190267346A1

公开(公告)日：2019-08-29

申请号：US15908759

申请日：2018-02-28

Applicant: POWERTECH TECHNOLOGY INC.

Inventor： Kun-Chi Hsu ,  Sheng-Tou Tseng ,  Hung-Chieh Huang

IPC: H01L23/00

Abstract: A flux transfer tool includes a heater, a flux supplier, an ejector and a baseplate. The heater has a nozzle. The flux supplier is connected to the heater and contains a flux. The ejector is connected to the heater. The baseplate has a plurality of first holes formed thereon. The flux supplier supplies the flux to the heater, the heater heats the flux, and the ejector ejects the flux from the nozzle to spray the flux on the baseplate.

公开(公告)号：US20190229064A1

公开(公告)日：2019-07-25

申请号：US15879305

申请日：2018-01-24

Applicant: Powertech Technology Inc.

Inventor： Chin-Ta Wu ,  Sheng-Tou Tseng ,  Kuo-Jhan Kao ,  Ying-Lin Chen ,  Cheng-Hung Song ,  Hung-Chieh Huang ,  Kun-Chi Hsu

IPC: H01L23/544 ,  H01L21/3205 ,  H01L21/268 ,  H01L23/31 ,  H01L21/285 ,  H01L21/321 ,  H01L23/552

Abstract: A laser color marking method for a semiconductor package has steps of: (a) providing a semiconductor element; (b) sputtering a metal layer on the semiconductor element; (c) obtaining a marking pattern; and (d) applying a laser light source on the marking region to form a mark according to the marking pattern. The mark is consisted of an optical oxide film converting ambient light to a corresponding color light, so a visible color mark is marked. Therefore, the present invention easily laser-marks the visible color mark on the semiconductor package.