Nanoassembly methods for producing quasi-three-dimensional nanoarrays

    公开(公告)号:US11518675B2

    公开(公告)日:2022-12-06

    申请号:US17126316

    申请日:2020-12-18

    Abstract: Nanoassembly methods for producing quasi-3D plasmonic films with periodic nanoarrays of nano-sized surface features. A sacrificial layer is deposited on a surface of a donor substrate having periodic nanoarrays of nanopattern features formed thereon. A plasmon film is deposited onto the sacrificial layer and a dielectric spacer is deposited on the plasmon film. The donor substrate having the sacrificial layer, plasmon film, and dielectric spacer thereon is immersed in a bath of etchant to selectively remove the sacrificial layer such that the plasmon film and the dielectric spacer thereon adhere to the surface of the donor substrate. The dielectric spacer and the plasmon film are mechanically separated from the donor substrate to define a quasi-three dimensional (3D) plasmonic film having periodic nanoarrays of nano-sized surface features defined by the nanopattern features of the donor substrate surface. The quasi-3D plasmonic film is then applied to a receiver substrate.

    NANOASSEMBLY METHODS FOR PRODUCING QUASI-THREE-DIMENSIONAL NANOARRAYS

    公开(公告)号:US20230117159A1

    公开(公告)日:2023-04-20

    申请号:US18061052

    申请日:2022-12-02

    Abstract: Nanoassembly methods for producing quasi-3D plasmonic films with periodic nanoarrays of nano-sized surface features. A sacrificial layer is deposited on a surface of a donor substrate having periodic nanoarrays of nanopattern features formed thereon. A plasmon film is deposited onto the sacrificial layer and a dielectric spacer is deposited on the plasmon film. The donor substrate having the sacrificial layer, plasmon film, and dielectric spacer thereon is immersed in a bath of etchant to selectively remove the sacrificial layer such that the plasmon film and the dielectric spacer thereon adhere to the surface of the donor substrate. The dielectric spacer and the plasmon film are mechanically separated from the donor substrate to define a quasi-three dimensional (3D) plasmonic film having periodic nanoarrays of nano-sized surface features defined by the nanopattern features of the donor substrate surface. The quasi-3D plasmonic film is then applied to a receiver substrate.

    NANOASSEMBLY METHODS FOR PRODUCING QUASI-THREE-DIMENSIONAL NANOARRAYS

    公开(公告)号:US20210229987A1

    公开(公告)日:2021-07-29

    申请号:US17126316

    申请日:2020-12-18

    Abstract: Nanoassembly methods for producing quasi-3D plasmonic films with periodic nanoarrays of nano-sized surface features. A sacrificial layer is deposited on a surface of a donor substrate having periodic nanoarrays of nanopattern features formed thereon. A plasmon film is deposited onto the sacrificial layer and a dielectric spacer is deposited on the plasmon film. The donor substrate having the sacrificial layer, plasmon film, and dielectric spacer thereon is immersed in a bath of etchant to selectively remove the sacrificial layer such that the plasmon film and the dielectric spacer thereon adhere to the surface of the donor substrate. The dielectric spacer and the plasmon film are mechanically separated from the donor substrate to define a quasi-three dimensional (3D) plasmonic film having periodic nanoarrays of nano-sized surface features defined by the nanopattern features of the donor substrate surface. The quasi-3D plasmonic film is then applied to a receiver substrate.

    METHODS OF FABRICATING INFRARED BANDPASS FILTERS AND INFRARED BANDPASS FILTERS FABRICATED THEREBY

    公开(公告)号:US20240367398A1

    公开(公告)日:2024-11-07

    申请号:US18048596

    申请日:2022-10-21

    Abstract: Methods of fabricating infrared bandpass filters and infrared bandpass filters fabricated thereby. The methods include forming metallic and dielectric spacer layers on a mold that defines nanoscale-sized recesses or protuberances, depositing a stress-absorbing layer on the dielectric spacer layer opposite the mold, and applying a force to the stress-absorbing layer to peel a first intermediate structure comprising the metallic layer, the dielectric spacer layer, and the stress-absorbing layer from the mold. The stress-absorbing layer may be dissolved from the first intermediate structure with a solvent to define a second intermediate structure. The second intermediate structure may be transferred to a receiver substrate to define the IR bandpass filter. The recesses or protuberances of the metallic and dielectric spacer layers are configured to function as quasi-three-dimensional (quasi-3D) plasmonic metal-dielectric hybrid nanostructures.

    Nanoassembly methods for producing quasi-three-dimensional nanoarrays

    公开(公告)号:US11802043B2

    公开(公告)日:2023-10-31

    申请号:US18061052

    申请日:2022-12-02

    Abstract: Nanoassembly methods for producing quasi-3D plasmonic films with periodic nanoarrays of nano-sized surface features. A sacrificial layer is deposited on a surface of a donor substrate having periodic nanoarrays of nanopattern features formed thereon. A plasmon film is deposited onto the sacrificial layer and a dielectric spacer is deposited on the plasmon film. The donor substrate having the sacrificial layer, plasmon film, and dielectric spacer thereon is immersed in a bath of etchant to selectively remove the sacrificial layer such that the plasmon film and the dielectric spacer thereon adhere to the surface of the donor substrate. The dielectric spacer and the plasmon film are mechanically separated from the donor substrate to define a quasi-three dimensional (3D) plasmonic film having periodic nanoarrays of nano-sized surface features defined by the nanopattern features of the donor substrate surface. The quasi-3D plasmonic film is then applied to a receiver substrate.

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