公开(公告)号：US20180374622A1

公开(公告)日：2018-12-27

申请号：US15722446

申请日：2017-10-02

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Bonhoon KOO ,  Babak NEJATI

IPC: H01F17/00 ,  H01F41/04

Abstract: A multi-layer spiral inductive array includes a first multi-layer spiral inductor with a second layer matching a spiral pattern of a first layer. The multi-layer spiral inductive array also includes a second multi-layer spiral inductor with a third layer matching a spiral pattern of a fourth layer. The second multi-layer spiral inductor is coupled in series with the first multi-layer spiral inductor.

公开(公告)号：US20190252316A1

公开(公告)日：2019-08-15

申请号：US16254735

申请日：2019-01-23

Applicant: QUALCOMM Incorporated

Inventor： Shu ZHANG ,  Daniel Daeik KIM ,  Chenqian GAN ,  Bonhoon KOO ,  Babak NEJATI

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/64 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01L23/5227 ,  H01F17/0013 ,  H01F17/02 ,  H01F27/2804 ,  H01F41/042 ,  H01F2017/002 ,  H01F2017/0073 ,  H01F2027/2809 ,  H01L23/52 ,  H01L23/645 ,  H01L28/10

Abstract: Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.

公开(公告)号：US20200020474A1

公开(公告)日：2020-01-16

申请号：US16034653

申请日：2018-07-13

Applicant: QUALCOMM Incorporated

Inventor： Daniel Daeik KIM ,  Bonhoon KOO ,  Babak NEJATI

IPC: H01F17/02 ,  H03F1/08

Abstract: A spiral inductor includes a spiral trace and a plurality of first projections extending along a first edge of the spiral trace. The spiral inductor may further include a plurality of second projections extending along a second edge of the spiral trace, the second edge being opposite the first edge.

公开(公告)号：US20190006999A1

公开(公告)日：2019-01-03

申请号：US15636626

申请日：2017-06-28

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Manuel ALDRETE ,  Bonhoon KOO

IPC: H03F1/30

CPC classification number: H03F1/30 ,  H01L23/66 ,  H01L2223/6677 ,  H03F2200/186 ,  H04B2001/0408

Abstract: An exemplary improved ground for a power amplifier circuit may include structural separation of the drive amplifier and the power amplifier grounds and cut-off of the power amplifier induced feedback current to ensure stability under a wide-range of operating conditions. The exemplary power amplifier may include a first ground coupled to a first amplifier circuit, a second ground coupled to a second amplifier circuit separate from the first ground, and the first amplifier circuit generates a drive current for the second amplifier circuit.

公开(公告)号：US20180316319A1

公开(公告)日：2018-11-01

申请号：US15584000

申请日：2017-05-01

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Shu ZHANG ,  Bonhoon KOO ,  Manuel ALDRETE ,  Jie FU ,  Chin-Kwan KIM ,  Babak NEJATI ,  Husnu Ahmet MASARACIOGLU

IPC: H03F1/52 ,  H03F3/189 ,  H03F3/20 ,  H03F1/56 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L23/12

CPC classification number: H01L23/12 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/16237 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49175

Abstract: In exemplary aspects of the disclosure, magnetic coupling problems in a power amplifier/antenna circuit may be address by using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate to offer full RF isolation of both PA output match inductors (self-shielded and embedded) or using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate along with a component level conformal shield around the self-shielded inductor on the assembly structure.