公开(公告)号：US09363902B2

公开(公告)日：2016-06-07

申请号：US14326189

申请日：2014-07-08

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： Chi Shun Lo ,  Jonghae Kim ,  Chengjie Zuo ,  Changhan Hobie Yun

IPC: H05K1/16 ,  H01F27/28 ,  H01L21/02 ,  H05K3/46 ,  H01F17/00

CPC classification number: H05K3/465 ,  H01F27/2804 ,  H01F2017/002 ,  H01F2017/004

Abstract: This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.

Abstract translation: 本公开提供了电感器，变压器和相关过程的实现。 一方面，一种装置包括具有第一表面和第二表面的基底。 第一感应装置包括第一组通孔，第二组通孔，布置在连接第一和第二通孔的第一表面上的第一组迹线，以及布置在第二表面上的第二组迹线，该第二组迹线连接第一和第二通孔 通孔 第二感应装置与第一感应装置电感耦合和交错，并且包括第三组通孔，第四组通孔，布置在连接第三和第四通孔的第一表面上的第三组迹线和第四组 布置在连接第三和第四通孔的第二表面上的迹线。 一组或多组电介质层将迹线的一部分彼此绝缘。

公开(公告)号：US09331666B2

公开(公告)日：2016-05-03

申请号：US13657653

申请日：2012-10-22

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： Chengjie Zuo ,  Jonghae Kim ,  Changhan Hobie Yun ,  Sang-June Park ,  Philip Jason Stephanou ,  Chi Shun Lo ,  Robert Paul Mikulka ,  Mario Francisco Velez ,  Ravindra V. Shenoy ,  Matthew Michael Nowak

IPC: H01L41/047 ,  H03H9/02 ,  H03H9/205 ,  H03H9/24

CPC classification number: H03H9/02157 ,  H03H9/02574 ,  H03H9/205 ,  H03H9/2405 ,  H03H2009/02503 ,  H03H2009/02527 ,  H03H2009/241

Abstract: This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes, one or more second electrodes, and a transduction layer arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component along the plane of the x axis and they axis.

Abstract translation: 本公开提供了与声谐振器相关的系统，方法和装置，其包括用于使得能够选择性地调谐一个或多个声学或机电特性的复合转导层。 一方面，谐振器结构包括一个或多个第一电极，一个或多个第二电极和布置在第一和第二电极之间的换能层。 换能层包括多个构成层。 在一些实施方式中，构成层包括一个或多个第一压电层和一个或多个第二压电层。 转导层被配置为响应于提供给第一和第二电极的信号，提供至少第一传感模式的振动，沿着z轴的位移分量和换能层的至少第二振动模式 具有沿着x轴的平面并且它们的轴线的位移分量。

公开(公告)号：US20140322435A1

公开(公告)日：2014-10-30

申请号：US14326189

申请日：2014-07-08

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： Chi Shun Lo ,  Jonghae Kim ,  Chengjie Zuo ,  Changhan Hobie Yun

IPC: H05K3/46

CPC classification number: H05K3/465 ,  H01F27/2804 ,  H01F2017/002 ,  H01F2017/004

Abstract: This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.

Abstract translation: 本公开提供了电感器，变压器和相关过程的实现。 一方面，一种装置包括具有第一表面和第二表面的基底。 第一感应装置包括第一组通孔，第二组通孔，布置在连接第一和第二通孔的第一表面上的第一组迹线，以及布置在第二表面上的第二组迹线，该第二组迹线连接第一和第二通孔 通孔 第二感应装置与第一感应装置电感耦合和交错，并且包括第三组通孔，第四组通孔，布置在连接第三和第四通孔的第一表面上的第三组迹线和第四组 布置在连接第三和第四通孔的第二表面上的迹线。 一组或多组电介质层将迹线的一部分彼此绝缘。

公开(公告)号：US20140111064A1

公开(公告)日：2014-04-24

申请号：US13657653

申请日：2012-10-22

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： Chengjie Zuo ,  Jonghae Kim ,  Changhan Hobie Yun ,  Sang-June Park ,  Philip Jason Stephanou ,  Chi Shun Lo ,  Robert Paul Mikulka ,  Mario Francisco Velez ,  Ravindra V. Shenoy ,  Matthew Michael Nowak

IPC: H01L41/083 ,  H01L41/18

CPC classification number: H03H9/02157 ,  H03H9/02574 ,  H03H9/205 ,  H03H9/2405 ,  H03H2009/02503 ,  H03H2009/02527 ,  H03H2009/241

Abstract: This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes, one or more second electrodes, and a transduction layer arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component along the plane of the x axis and they axis.

Abstract translation: 本公开提供了与声谐振器相关的系统，方法和装置，其包括用于使得能够选择性地调谐一个或多个声学或机电特性的复合转导层。 一方面，谐振器结构包括一个或多个第一电极，一个或多个第二电极和布置在第一和第二电极之间的换能层。 换能层包括多个构成层。 在一些实施方式中，构成层包括一个或多个第一压电层和一个或多个第二压电层。 转导层被配置为响应于提供给第一和第二电极的信号，提供至少第一传感模式的振动，沿着z轴的位移分量和换能层的至少第二振动模式 具有沿着x轴的平面并且它们的轴线的位移分量。