公开(公告)号：US4646057A

公开(公告)日：1987-02-24

申请号：US702021

申请日：1985-02-15

Applicant: Quentin M. Reynolds

Inventor： Quentin M. Reynolds

IPC: H01C1/14 ,  H01C1/144 ,  H01C7/00 ,  H01C17/00 ,  H01C17/24 ,  H01C17/242 ,  H01C17/28 ,  H05K3/34 ,  H01G1/14

CPC classification number: H05K3/3442 ,  H01C1/144 ,  H01C17/006 ,  H01C17/242 ,  H01C17/28 ,  H05K2201/09181 ,  H05K2201/09572 ,  H05K2201/10636 ,  H05K2201/10984 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A method of forming chip resistors in which a resistive coating is applied to an insulating substrate which is subsequently divided up into single chip components includes the step of providing end terminations for the individual chip resistors before the sheet is divided up. This is achieved by forming a hole 13 in the substrate 11 at the position of each end termination and then coating the holes with an electrically conductive material 14 which electrically connects with the adjacent region of the resistive coating 12. In order to improve the solderability and the reliability of the end terminations the holes 13 may be filled with solder 15. The electrical value of the resistive element coating may then be adjusted to a precise value by trimming away some of the resistive element material with a laser. Finally, the substrate is divided up into the single chip resistor components.

Abstract translation: 一种形成片状电阻器的方法，其中将电阻涂层施加到绝缘衬底上，该绝缘衬底随后被分成单个芯片部件，包括在片材被分割之前为各个芯片电阻器提供端接端的步骤。 这是通过在每个端部端子的位置处在基板11中形成孔13，然后用与电阻涂层12的相邻区域电连接的导电材料14涂覆孔来实现的。为了改善可焊性和 可以用焊料15填充孔13的端部端接的可靠性。然后可以通过用激光器去除一些电阻元件材料来将电阻元件涂层的电气值调整到精确的值。 最后，将基板分为单片电阻器组件。