公开(公告)号：US10388587B1

公开(公告)日：2019-08-20

申请号：US16106618

申请日：2018-08-21

Applicant: RAYTHEON COMPANY

Inventor： David R. Smith ,  William C. Mollberg ,  Daniel P. Feeney ,  Ky Mickelsen

IPC: C08F4/10 ,  C08G81/02 ,  H01L23/373 ,  H05B33/08

Abstract: A thermal interface structure includes a first surface including a surface of a heat generating device, a first surface binding polymer bonded to the first surface, a second surface including a surface of a heat sink, and a second surface binding polymer bonded to the second surface. The first surface binding polymer and the second surface binding polymer cross-link to one another to form a covalently bonded, cross-linked section that creates a thermal interface material that forms a continuous molecular connection between the first surface and the second surface.