公开(公告)号：US09729194B2

公开(公告)日：2017-08-08

申请号：US13739997

申请日：2013-01-11

Applicant: Renesas Electronics Corporation

Inventor： Atsushi Nakamura ,  Masahiro Toyama ,  Masafumi Watanabe ,  Kota Toida ,  Aya Ohmae ,  Wen Li

IPC: H04B1/707 ,  H04B1/7073 ,  H04B15/04

CPC classification number: H04B1/7073 ,  H04B15/04

Abstract: To provide a clock control circuit, a demodulation device, and a spread spectrum method, which can reduce interference caused by a clock signal on which spread spectrum is performed when demodulating a signal. A clock controller 22 according to the present invention disperses a harmonic of a clock signal in a used frequency band of a reception signal and controls a harmonic remaining in the used frequency band after the dispersion. For example, the clock controller 22 controls an amplitude of the harmonic on the basis of a spread frequency used for the dispersion and a spread width of the harmonic.

公开(公告)号：US09549461B2

公开(公告)日：2017-01-17

申请号：US14625440

申请日：2015-02-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Masahiro Toyama ,  Motoo Suwa

IPC: H05K7/00 ,  H05K1/02

CPC classification number: H05K1/0231 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/025 ,  H05K2201/10545 ,  H01L2924/00012

Abstract: To improve electric characteristics of an electronic device. An electronic device includes a semiconductor device and a three-terminal capacitor mounted on the upper surface of a mounting substrate, the semiconductor device includes a power supply pad and a ground pad, the power supply pad and the ground pad are electrically connected with a power supply land and a ground land, respectively, and the power supply land and the ground land are allocated to a land line in an outermost periphery of the semiconductor device, Then, the power supply land and the ground land are electrically connected to the three-terminal capacitor by wirings formed on the upper surface of the mounting substrate.

Abstract translation: 改善电子设备的电气特性。 电子设备包括安装在安装基板的上表面上的半导体器件和三端电容器，该半导体器件包括电源焊盘和接地焊盘，电源焊盘和接地焊盘与电源电连接 分别供给地面和陆地，将电力供给用地和地面用地分配给半导体装置的最外周的陆线，然后，将电源用地和地面电连接到三相电源， 端子电容器通过布线形成在安装基板的上表面上。

公开(公告)号：US10063277B2

公开(公告)日：2018-08-28

申请号：US15649275

申请日：2017-07-13

Applicant: Renesas Electronics Corporation

Inventor： Atsushi Nakamura ,  Masahiro Toyama ,  Masafumi Watanabe ,  Kota Toida ,  Aya Ohmae ,  Wen Li

IPC: H04B1/707 ,  H04B1/7073 ,  H04B15/04

CPC classification number: H04B1/7073 ,  H04B15/04

Abstract: A clock control circuit includes a clock controller which disperses a harmonic of a clock signal in a used frequency band of a reception signal and controls an amplitude of a harmonic remaining in the used frequency band after the dispersion on a basis of a spread frequency used for the dispersion and a spread width of the harmonic.