公开(公告)号：US20240383035A1

公开(公告)日：2024-11-21

申请号：US18770661

申请日：2024-07-12

Applicant: RESONAC CORPORATION

Inventor： Yoshinori EJIRI ,  Shinichirou SUKATA ,  Masaya TOBA ,  Hideo NAKAKO ,  Yuki KAWANA ,  Kosuke URASHIMA ,  Motoki YONEKURA ,  Takaaki NOHDOH ,  Yoshiaki KURIHARA ,  Hiroshi MASUDA ,  Keita SONE

IPC: B22F7/08 ,  B22F1/052 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12 ,  H05K3/34

Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.