公开(公告)号：US3873429A

公开(公告)日：1975-03-25

申请号：US37788473

申请日：1973-07-09

Applicant: ROCKWELL INTERNATIONAL CORP

Inventor： BROWN ELVIN E

IPC: H05K1/11 ,  H05K3/42 ,  C23B5/48

CPC classification number: H05K1/116 ,  H05K3/428 ,  H05K2201/0376 ,  H05K2203/0278 ,  H05K2203/0542

Abstract: A process for producing flush printed circuits with plated through holes comprising etching the circuit paths, flushing the circuit paths with the surface of the material, drilling the holes and producing plating material in the hole area through and subsequent to the use of electroless flash material and then removing the flash from all areas other than the hole portion of the circuit board.

Abstract translation: 一种用于制造具有电镀通孔的冲压印刷电路的方法，包括蚀刻电路路径，用材料的表面冲洗电路路径，钻孔并在孔区域中通过使用无电闪光材料产生电镀材料， 然后从电路板的孔部以外的所有区域除去闪光。