公开(公告)号：US20220302094A1

公开(公告)日：2022-09-22

申请号：US17636258

申请日：2020-07-21

Applicant: ROHM CO., LTD.

Inventor： Yuya HASEGAWA ,  Takaaki MASAKI

IPC: H01L25/16 ,  H01L31/0203 ,  H01L33/54 ,  H01L31/0232 ,  H01L33/58

Abstract: An optical sensor includes a substrate including a substrate main surface intersecting a thickness-wise direction, a light emitting element disposed on the substrate main surface, a light receiving element disposed on the substrate main surface, a transparent first cover disposed on the substrate main surface to cover the light emitting element, and a transparent second cover disposed on the substrate main surface to cover the light receiving element. The first cover and the second cover are spaced apart by a gap.

公开(公告)号：US20250105584A1

公开(公告)日：2025-03-27

申请号：US18882846

申请日：2024-09-12

Applicant: ROHM CO., LTD.

Inventor： Okimoto KONDO ,  Yuya HASEGAWA

IPC: H01S5/02255 ,  H01S5/02234 ,  H01S5/183

Abstract: A semiconductor light emitting device includes: a surface emitting laser element including an element front surface and configured to emit laser light from the element front surface; an element container including a bottom wall where the surface emitting laser element is arranged and a peripheral wall surrounding the surface emitting laser element when viewed from a direction perpendicular to the element front surface, the bottom wall and the peripheral wall constituting a containing space which contains the surface emitting laser element and is open on a same side as the element front surface; a diffusion layer covering the element front surface in the containing space and including a diffusion material; and a reflector covering at least one selected from the group of the bottom wall and the peripheral wall in the containing space and made of a resin material having a higher reflectivity than the diffusion layer.

公开(公告)号：US20170268753A1

公开(公告)日：2017-09-21

申请号：US15459905

申请日：2017-03-15

Applicant: ROHM CO., LTD.

Inventor： Hiroyuki TAJIRI ,  Yuya HASEGAWA

IPC: F21V19/00 ,  H01L25/16 ,  H01L33/62 ,  H01L33/60 ,  F21V29/89 ,  H01L33/48 ,  H01L33/64 ,  F21V7/04 ,  F21V23/06 ,  F21V29/74 ,  H01L25/075 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H05K1/0268 ,  H05K3/3431 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613

Abstract: An LED lighting apparatus is provided. The LED lighting apparatus includes LED chips, a substrate, and an electronic element. The substrate includes a mount surface on which the LED chips are mounted. The LED chips are arranged at or near a center of the mount surface of the substrate. The substrate includes a base, a wiring pattern, and an insulating layer. The wiring pattern is formed on the base. The insulating layer is formed on the base or the wiring pattern and formed with a plurality of openings. The wiring pattern includes pad portions comprising parts of the wiring pattern, respectively. Each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate. Each of the LED chips is mounted on one of the pad portions.