公开(公告)号：US20220121676A2

公开(公告)日：2022-04-21

申请号：US16651870

申请日：2018-09-28

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Kevin Barr ,  Edward Andrew Condon

IPC: G06F16/25 ,  G06F16/176 ,  G06F16/26 ,  G06F16/28

Abstract: A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.

公开(公告)号：US10664714B2

公开(公告)日：2020-05-26

申请号：US15850869

申请日：2017-12-21

Applicant: Rudolph Technologies, Inc.

Inventor： Kevin Barr

IPC: G06K9/00 ,  G06K9/18 ,  G03F9/00 ,  G03F7/20 ,  G06K9/20 ,  H01L23/544

Abstract: A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.

公开(公告)号：US20180173984A1

公开(公告)日：2018-06-21

申请号：US15850869

申请日：2017-12-21

Applicant: Rudolph Technologies, Inc.

Inventor： Kevin Barr

IPC: G06K9/18 ,  G03F7/20 ,  G03F9/00

CPC classification number: G06K9/183 ,  G03F7/70541 ,  G03F7/70775 ,  G03F9/7034 ,  G06K9/2063 ,  G06K2209/19 ,  H01L23/544 ,  H01L2223/54433

Abstract: A structure and method for employing the structure to reliably read indicia formed on a substrate such as a panel or wafer is disclosed. A gripping member pulls the substrate into at least partial compliance with a locating structure to facilitate the proper function of a code reader. Where the indicia are not read, the substrate is moved relative to the code reader, starting from a position that may be determined based on the material properties of the substrate.

公开(公告)号：US20220012261A2

公开(公告)日：2022-01-13

申请号：US16651870

申请日：2018-09-28

Applicant: Rudolph Technologies, Inc.

Inventor： Kevin Barr ,  Edward Condon

IPC: G06F16/25 ,  G06F16/176 ,  G06F16/26 ,  G06F16/28

Abstract: A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.