公开(公告)号：US09460953B2

公开(公告)日：2016-10-04

申请号：US14758718

申请日：2013-12-20

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Isao Sato ,  Hiroki Ueno ,  Yasutoshi Ito ,  Masataka Ryu ,  Troy Palm

IPC: H01L21/687 ,  B25J11/00 ,  H01L21/67 ,  B25J15/00

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/67259

Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.

Abstract translation: 公开了一种用于处理诸如半导体晶片的衬底的机构。 该机构以倾斜方向支撑衬底，以确保弓形衬底和机构之间不会发生不期望的接触。 以倾斜方向支撑衬底的结构可以是固定的或可调节的。 可以提供传感器来测量和/或监测衬底和机构之间的距离。 或者，可以提供用于确定基板和机构之间的接触的传感器。

公开(公告)号：US20150371886A1

公开(公告)日：2015-12-24

申请号：US14758718

申请日：2013-12-20

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Isao Sato ,  Hiroki Ueno ,  Yasutoshi Ito ,  Masataka Ryu ,  Troy Palm

IPC: H01L21/687 ,  H01L21/67 ,  B25J15/00

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/67259

Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.

Abstract translation: 公开了一种用于处理诸如半导体晶片的衬底的机构。 该机构以倾斜方向支撑衬底，以确保弓形衬底和机构之间不会发生不期望的接触。 以倾斜方向支撑衬底的结构可以是固定的或可调节的。 可以提供传感器来测量和/或监测衬底和机构之间的距离。 或者，可以提供用于确定基板和机构之间的接触的传感器。