公开(公告)号：US11778731B2

公开(公告)日：2023-10-03

申请号：US17503988

申请日：2021-10-18

Applicant: Raytheon Company

Inventor： Thanh Tran ,  David G. Haedge ,  Alton Moore ,  Paul Ingerson

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K1/112 ,  H05K1/114 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/09636 ,  H05K2201/09672 ,  H05K2201/09718

Abstract: A multi-layer printed circuit board having a first landing pad in a first layer and along a first axis arranged to receive a positive signal and a second landing pad in the first layer and along a second axis that is spaced away from the first axis longitudinally in the first layer and where the second landing pad arranged to receive a negative signal. A first buried in a second layer and along the first axis is spaced away from the first landing pad along the first axis. A second buried in the second layer and along the second axis is spaced away from the second landing pad along the second axis. A first signal connector provides a first electrical connection between the first landing pad and the second buried via and a second signal connector provides a second electrical connection between the second landing pad and the first buried via.

公开(公告)号：US20230121836A1

公开(公告)日：2023-04-20

申请号：US17503988

申请日：2021-10-18

Applicant: Raytheon Company

Inventor： Thanh Tran ,  David G. Haedge ,  Alton Moore ,  Paul Ingerson

IPC: H05K1/02 ,  H05K1/11

Abstract: A multi-layer printed circuit board having a first landing pad in a first layer and along a first axis arranged to receive a positive signal and a second landing pad in the first layer and along a second axis that is spaced away from the first axis longitudinally in the first layer and where the second landing pad arranged to receive a negative signal. A first buried in a second layer and along the first axis is spaced away from the first landing pad along the first axis. A second buried in the second layer and along the second axis is spaced away from the second landing pad along the second axis. A first signal connector provides a first electrical connection between the first landing pad and the second buried via and a second signal connector provides a second electrical connection between the second landing pad and the first buried via.