公开(公告)号：US20220407207A1

公开(公告)日：2022-12-22

申请号：US17349018

申请日：2021-06-16

Applicant: Raytheon Company

Inventor： Karl L. Worthen ,  James S. Wilson ,  Joshua Lamb

IPC: H01P5/107

Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.

公开(公告)号：US11682814B2

公开(公告)日：2023-06-20

申请号：US17349018

申请日：2021-06-16

Applicant: Raytheon Company

Inventor： Karl L. Worthen ,  James S. Wilson ,  Joshua Lamb

IPC: H01P1/04 ,  H01P5/107 ,  H01P5/02

CPC classification number: H01P1/042 ,  H01P5/024 ,  H01P5/107

Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.

公开(公告)号：US11350490B2

公开(公告)日：2022-05-31

申请号：US15453269

申请日：2017-03-08

Applicant: Raytheon Company

Inventor： James S. Wilson ,  Joshua Lamb ,  Steven P. McFarlane

IPC: H05B1/02 ,  H05K7/20 ,  H05B3/14 ,  H05B3/22 ,  H01L21/48 ,  G06F1/20 ,  G05D23/19 ,  H01L23/34

Abstract: A multi-layer ceramic module is provided that includes an integrated temperature control and a power switch. The integrated temperature control is configured to dissipate thermal energy. The power switch is configured to couple a power source for a standard component of the multi-layer ceramic module to the integrated temperature control.

公开(公告)号：US20180263079A1

公开(公告)日：2018-09-13

申请号：US15453269

申请日：2017-03-08

Applicant: Raytheon Company

Inventor： James S. Wilson ,  Joshua Lamb ,  Steven P. McFarlane

IPC: H05B1/02 ,  H05K7/20 ,  H05B3/14 ,  H05B3/22

CPC classification number: H05B1/02 ,  G05D23/19 ,  G06F1/206 ,  H01L21/4857 ,  H01L23/34 ,  H05B3/141 ,  H05B3/22 ,  H05K7/20

Abstract: A multi-layer ceramic module is provided that includes an integrated temperature control and a power switch. The integrated temperature control is configured to dissipate thermal energy. The power switch is configured to couple a power source for a standard component of the multi-layer ceramic module to the integrated temperature control.