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公开(公告)号：US12076805B2
公开(公告)日：2024-09-03
申请号：US17103368
申请日：2020-11-24
Applicant: RAYTHEON COMPANY
Inventor： Trae M. Blain , James S. Wilson
CPC classification number: B23K1/0012 , B23K1/0008 , C23C14/16 , C25D5/02 , H05K7/2039 , C25D5/50
Abstract: A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.
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公开(公告)号：US11653473B2
公开(公告)日：2023-05-16
申请号：US16867465
申请日：2020-05-05
Applicant: Raytheon Company
Inventor： James S. Wilson , Gordon R. Scott , James M. Giesey
CPC classification number: H05K7/20254 , H05K7/06 , H05K7/20272
Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.
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公开(公告)号：US20220143736A1
公开(公告)日：2022-05-12
申请号：US17095878
申请日：2020-11-12
Applicant: Raytheon Company
Inventor： Travis Lee Mayberry , Cory Thomas , Robert Arthur Condie , James S. Wilson
Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
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公开(公告)号：US12278159B2
公开(公告)日：2025-04-15
申请号：US18493194
申请日：2023-10-24
Applicant: Raytheon Company
Inventor： James S. Wilson , Alyson M. Tuttle , Karl L. Worthen
IPC: H01L23/367 , H01L23/373 , H01L23/473
Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
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公开(公告)号：US20230341190A1
公开(公告)日：2023-10-26
申请号：US17660186
申请日：2022-04-21
Applicant: Raytheon Company
Inventor： Trae M. Blain , James S. Wilson
CPC classification number: F28D15/0266 , C25D1/003 , F28F2255/00
Abstract: A method includes using electroforming to deposit a first portion of material. The method also includes placing a preformed tube on the first portion of material, where the preformed tube includes multiple capillary pathways and multiple bends. The method further includes using electroforming to deposit a second portion of material over the first portion of material and over the preformed tube to form a heat exchanger. The preformed tube forms at least a portion of a pulsating heat pipe within the heat exchanger, and the pulsating heat pipe is configured to transport thermal energy through the heat exchanger.
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Patent Agency Ranking
公开(公告)号：US20230302567A1
公开(公告)日：2023-09-28
申请号：US18205248
申请日：2023-06-02
Applicant: Raytheon Company
Inventor： Travis Lee Mayberry , Cory Thomas , Robert Arthur Condie , James S. Wilson
CPC classification number: B23K20/103 , B23K20/2333 , B23P15/26 , F28F3/025 , F28F9/0224 , F28F9/18 , B33Y10/00
Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
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公开(公告)号：US20220407207A1
公开(公告)日：2022-12-22
申请号：US17349018
申请日：2021-06-16
Applicant: Raytheon Company
Inventor： Karl L. Worthen , James S. Wilson , Joshua Lamb
IPC: H01P5/107
Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.
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公开(公告)号：US20190170406A1
公开(公告)日：2019-06-06
申请号：US15831180
申请日：2017-12-04
Applicant: Raytheon Company
Inventor： James S. Wilson , Alex E. Ockfen , Adolfo Lozano, III , Amanda S. Rickman
Abstract: An apparatus includes a heat sink configured to receive thermal energy from one or more heat sources. The heat sink includes a local reservoir configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.
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公开(公告)号：US20240055318A1
公开(公告)日：2024-02-15
申请号：US18493194
申请日：2023-10-24
Applicant: Raytheon Company
Inventor： James S. Wilson , Alyson M. Tuttle , Karl L. Worthen
IPC: H01L23/367
CPC classification number: H01L23/3677 , H01L23/3736
Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
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公开(公告)号：US11682814B2
公开(公告)日：2023-06-20
申请号：US17349018
申请日：2021-06-16
Applicant: Raytheon Company
Inventor： Karl L. Worthen , James S. Wilson , Joshua Lamb
Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.
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