公开(公告)号：US09704907B1

公开(公告)日：2017-07-11

申请号：US15094505

申请日：2016-04-08

Applicant: Raytheon Company

Inventor： Jay R. Neumann ,  Peter M. Randolph ,  Chad W. Fulk

IPC: H01L27/14 ,  H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469

Abstract: An electro-optical sensor chip assembly (SCA) is provided and includes a read-out integrated circuit (ROIC), a detector including a substrate, a buffer layer, a pixel layer and an array of pixels disposed in the pixel layer and an interconnect layer interposed between the ROIC and the pixel layer and comprising cold welded interconnect posts respectively extendible to the ROIC from the pixels. The detector is penetrable by visible wavelength light propagating from a direct view window formed in the substrate and the buffer layer to one or more of the pixels.