公开(公告)号：US10410760B2

公开(公告)日：2019-09-10

申请号：US15194427

申请日：2016-06-27

Applicant: Raytheon Company

Inventor： Jay R. Neumann ,  Thomas F. McEwan ,  David E. Sigurdson ,  Alberto Perez ,  Janine F. Lambe ,  Gregory D. Tracy

IPC: H01B7/04 ,  H05K5/00 ,  H05K1/02 ,  H01R12/79 ,  H01L27/146 ,  G06F13/20 ,  H01P3/08 ,  H04N5/225 ,  H05K3/46 ,  H04M1/02

Abstract: A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.

公开(公告)号：US09704907B1

公开(公告)日：2017-07-11

申请号：US15094505

申请日：2016-04-08

Applicant: Raytheon Company

Inventor： Jay R. Neumann ,  Peter M. Randolph ,  Chad W. Fulk

IPC: H01L27/14 ,  H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469

Abstract: An electro-optical sensor chip assembly (SCA) is provided and includes a read-out integrated circuit (ROIC), a detector including a substrate, a buffer layer, a pixel layer and an array of pixels disposed in the pixel layer and an interconnect layer interposed between the ROIC and the pixel layer and comprising cold welded interconnect posts respectively extendible to the ROIC from the pixels. The detector is penetrable by visible wavelength light propagating from a direct view window formed in the substrate and the buffer layer to one or more of the pixels.

公开(公告)号：US20170200529A1

公开(公告)日：2017-07-13

申请号：US15194427

申请日：2016-06-27

Applicant: Raytheon Company

Inventor： Jay R. Neumann ,  Thomas F. McEwan ,  David E. Sigurdson ,  Alberto Perez ,  Janine F. Lambe ,  Gregory D. Tracy

IPC: H01B7/04 ,  G06F13/20 ,  H01R12/79 ,  H01L27/146 ,  H05K5/00 ,  H05K1/02

Abstract: A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.