公开(公告)号：US5703761A

公开(公告)日：1997-12-30

申请号：US699327

申请日：1996-08-19

Applicant: Reinhold Heiss

Inventor： Reinhold Heiss

IPC: H01L23/552 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K7/14

CPC classification number: H05K9/0045 ,  H01L23/552 ,  H05K1/0218 ,  H01L2924/16152 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1311 ,  H05K3/28 ,  Y10S174/34

Abstract: For shielding of flat modules having high-frequency components in information technology equipment, a surface of the shielding extends only over a region of the components to be shielded. The shielding surface is connected in an electrically conductive manner with a contact surface on the circuit board that surrounds the components.

Abstract translation: 为了在信息技术设备中屏蔽具有高频分量的平板模块，屏蔽层的表面仅在待屏蔽部件的区域上延伸。 屏蔽表面以导电方式连接在电路板上的围绕部件的接触表面。

公开(公告)号：US5731963A

公开(公告)日：1998-03-24

申请号：US616631

申请日：1996-03-15

Applicant: Reinhold Heiss ,  Friedrich Schroeder

Inventor： Reinhold Heiss ,  Friedrich Schroeder

IPC: H04B1/3827 ,  H04M1/02 ,  H04B1/03

CPC classification number: H04B1/3833 ,  H04B1/3838 ,  H04M1/0202 ,  Y10S174/34

Abstract: A housing is provided for a radio device, such as a portable cellular telephone, in a housing arrangement which includes an integral electromagnetic shield. A thin conductive film is applied to an interior or exterior surface of one or more shell-type housing parts. This thin film may be applied during an injection molding process to form the shell-type parts. The shell-type parts are shaped to define a cavity for encasing electronic components of the radio device, and for securably receiving an associated circuit board. The thin film is disposed to extend over a supporting edge of the corresponding housing part so that circuit board grounding surfaces are in low-resistance contact with the shielding film. The film thereby provides the housing with an integrated shielding function against electromagnetic radiation.

Abstract translation: 在包括整体电磁屏蔽的外壳装置中，为诸如便携式蜂窝电话的无线电设备提供外壳。 将薄导电膜施加到一个或多个壳型壳体部件的内表面或外表面。 这种薄膜可以在注射成型过程中施加以形成壳型部件。 壳型部件被成形为限定用于封装无线电设备的电子部件的空腔，并且用于可靠地接收相关联的电路板。 薄膜被设置成在对应的壳体部分的支撑边缘上延伸，使得电路板接地表面与屏蔽膜低电阻接触。 因此，膜对外壳提供抵抗电磁辐射的集成屏蔽功能。