公开(公告)号：US20240080977A1

公开(公告)日：2024-03-07

申请号：US18313518

申请日：2023-05-08

Applicant: Renesas Electronics America Inc.

Inventor： Zhizheng LIU ,  Haiyu ZHANG ,  Sri Ganesh A THARUMALINGAM ,  Mark Alan KWOKA ,  Yonggoo EOM

IPC: H05K1/11 ,  H01F27/30 ,  H05K1/16

CPC classification number: H05K1/111 ,  H01F27/306 ,  H05K1/165

Abstract: According to an example, a structure is generally described. The structure may include an inductor core having a plurality of surfaces; and at least one conductor integrated with at least one surface of the plurality of surfaces of the inductor core.