公开(公告)号：US20240321824A1

公开(公告)日：2024-09-26

申请号：US18187300

申请日：2023-03-21

Applicant: Renesas Electronics America Inc.

Inventor： Tetsuo SATO ,  Jianghong DING ,  Yonggoo EOM

IPC: H01L23/00 ,  H01L27/088 ,  H03K17/687

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L27/088 ,  H03K17/6871 ,  H03K17/6877 ,  H01L2924/1426 ,  H03K2217/0063

Abstract: Circuits and devices for a motor driver are described. A hybrid integrated circuit (IC) can include a driver IC, a first IC, and a plurality of second ICs. The first IC can include a plurality of high-side metal-oxide-semiconductor field-effect transistors (MOSFETs). The first IC can further include a common drain terminal connected to drains of the plurality of high-side MOSFETs. Each one of the plurality of second ICs can include a respective low-side MOSFET. The hybrid IC can further include a first set of bonding wires connecting the driver IC to the first IC. The hybrid IC can further include a second set of bonding wires connecting the driver IC to the plurality of second ICs. The hybrid IC can further include a third set of bonding wires connecting the first IC to the plurality of second ICs.

公开(公告)号：US20240080977A1

公开(公告)日：2024-03-07

申请号：US18313518

申请日：2023-05-08

Applicant: Renesas Electronics America Inc.

Inventor： Zhizheng LIU ,  Haiyu ZHANG ,  Sri Ganesh A THARUMALINGAM ,  Mark Alan KWOKA ,  Yonggoo EOM

IPC: H05K1/11 ,  H01F27/30 ,  H05K1/16

CPC classification number: H05K1/111 ,  H01F27/306 ,  H05K1/165

Abstract: According to an example, a structure is generally described. The structure may include an inductor core having a plurality of surfaces; and at least one conductor integrated with at least one surface of the plurality of surfaces of the inductor core.