公开(公告)号：US20240032209A1

公开(公告)日：2024-01-25

申请号：US18036798

申请日：2021-11-16

Applicant: Resonac Corporation

Inventor： Chihiro HAYASHI ,  Minoru KAKITANI ,  Takao TANIGAWA ,  Ryuji AKEBI ,  Naoyoshi SATO ,  Akira HORIE

IPC: H05K3/46 ,  C08L39/04 ,  H05K3/12 ,  H05K1/03 ,  H01L23/498

CPC classification number: H05K3/4652 ,  C08L39/04 ,  H05K3/1283 ,  H05K1/0353 ,  H01L23/49822 ,  C08L2203/20 ,  H05K2203/068 ,  H05K2201/10007

Abstract: Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

公开(公告)号：US20230391940A1

公开(公告)日：2023-12-07

申请号：US18036769

申请日：2021-11-16

Applicant: Resonac Corporation

Inventor： Naoyoshi SATO ,  Shuji GOZU ,  Minoru KAKITANI ,  Takao TANIGAWA ,  Ryuji AKEBI ,  Chihiro HAYASHI

IPC: C08F279/02 ,  C08J5/24 ,  H05K1/03 ,  C08L51/06 ,  H01L23/14

CPC classification number: C08F279/02 ,  C08J5/246 ,  H05K1/0353 ,  C08L51/06 ,  H01L23/145 ,  C08J2351/06 ,  C08L2203/16 ,  C08L2203/20

Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof, and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) dissolves in an alcohol-based solvent, a ketone-based solvent, an aromatic hydrocarbon-based solvent, an ester-based solvent, or a nitrogen atom-containing solvent in an amount of 30% by mass or more at 25° C. The present invention also relates to a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

公开(公告)号：US20230392001A1

公开(公告)日：2023-12-07

申请号：US18036784

申请日：2021-11-16

Applicant: Resonac Corporation

Inventor： Naoyoshi SATO ,  Shuji GOZU ,  Minoru KAKITANI ,  Takao TANIGAWA ,  Ryuji AKEBI ,  Chihiro HAYASHI

IPC: C08L35/00 ,  C08J5/24 ,  C08J5/18 ,  H01L23/14

CPC classification number: C08L35/00 ,  C08J5/24 ,  C08J5/18 ,  H01L23/145 ,  C08L2203/20 ,  C08L2205/03 ,  C08J2335/00 ,  C08J2347/00 ,  C08J2353/02

Abstract: The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.