公开(公告)号：US20250159815A1

公开(公告)日：2025-05-15

申请号：US18836527

申请日：2023-02-08

Applicant: Resonac Corporation

Inventor： Masashi OHKOSHI ,  Yuka ITOH ,  Shunsuke TAKAGI ,  Kunihiko AKAI ,  Nozomu TAKANO ,  Hiroyuki IZAWA ,  Daisuke FUJIMOTO ,  Tomohiko KOTAKE

IPC: H05K3/10 ,  H05K1/02

Abstract: A member for forming wiring includes a metal layer and an adhesive layer disposed on the metal layer. The adhesive layer contains conductive particles, a thermosetting resin, and a maleimide compound. A member for forming wiring in which an adhesive layer and a metal layer are provided separately, and the adhesive layer is adherable to the metal layer at the point of use. The adhesive layer contains conductive particles, a thermosetting resin, and a maleimide compound.

公开(公告)号：US20240238804A1

公开(公告)日：2024-07-18

申请号：US18559618

申请日：2022-05-02

Applicant: Toshiyuki SUGIMOTO ,  Resonac Corporation

Inventor： Shohei YAMAZAKI ,  Hiroyuki IZAWA ,  Toshiyuki SUGIMOTO

IPC: B03C7/02 ,  B07B13/04

CPC classification number: B03C7/02 ,  B07B13/04

Abstract: A method for classifying solder particles includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 included in an electrostatic attraction device, the first electrode 2 having a disposition part having electrostatic diffusivity or electrical conductivity, the second electrode 3 having an attraction part 4 having electrical insulation properties, which faces the disposition part and is provided with a plurality of opening parts 10 opened to the disposition part side, so as to cause solder particles P disposed on the disposition part to be electrostatically attracted to the attraction part 4; a second step of removing solder particles P2 attracted to areas other than the opening parts 10 of the attraction part 4; and a third step of collecting solder particles P1 accommodated in the opening parts, from the attraction part 4 that has been subjected to the second step.

公开(公告)号：US20240352287A1

公开(公告)日：2024-10-24

申请号：US18683425

申请日：2022-08-10

Applicant: Resonac Corporation

Inventor： Masashi OHKOSHI ,  Nozomu TAKANO ,  Kunihiko AKAI ,  Hiroyuki IZAWA ,  Yuka ITOH ,  Shunsuke TAKAGI

IPC: C09J9/02 ,  C09J179/08 ,  H05K1/11 ,  H05K3/46

CPC classification number: C09J9/02 ,  C09J179/08 ,  H05K1/113 ,  H05K3/46 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2203/0278 ,  H05K2203/1105

Abstract: A curable adhesive composition used for bonding a wiring member constituting a multilayered wiring board, in which the curable adhesive composition satisfies all the following conditions (A) and (B) when a thermal expansion coefficient and a glass transition temperature of a cured product are designated as CTE0 (ppm/° C.) and Tg0 (° C.), respectively:







(
A
)

⁢

5

≤

CTE
0

≤
270

⁢





(
B
)

⁢

140

≤

Tg
0

≤
280

公开(公告)号：US20250142722A1

公开(公告)日：2025-05-01

申请号：US18836471

申请日：2023-02-08

Applicant: Resonac Corporation

Inventor： Masashi OHKOSHI ,  Yuka ITOH ,  Shunsuke TAKAGI ,  Kunihiko AKAI ,  Nozomu TAKANO ,  Hiroyuki IZAWA ,  Daisuke FUJIMOTO ,  Tomohiko KOTAKE

IPC: H05K1/09 ,  H05K3/38

Abstract: A member 1 for forming wiring includes an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition containing conductive particles 12 and a thermosetting component. The metal layer 20 is disposed on the adhesive layer 10. In such a member 1 for forming wiring, the adhesive layer contains an epoxy resin and a phenolic resin, as the thermosetting component.

公开(公告)号：US20250024609A1

公开(公告)日：2025-01-16

申请号：US18713272

申请日：2022-11-28

Applicant: Resonac Corporation

Inventor： Masashi OHKOSHI ,  Yuka ITOH ,  Shunsuke TAKAGI ,  Kunihiko AKAI ,  Nozomu TAKANO ,  Hiroyuki IZAWA ,  Daisuke FUJIMOTO ,  Tomohiko KOTAKE

IPC: H05K3/38

Abstract: A wiring-forming member 1 includes an adhesive layer 10 containing conductive particles 12, and a metal layer 20 disposed on the adhesive layer 10. The adhesive layer 10 includes a first adhesive layer 15 containing the conductive particles 12 and an adhesive component, and a second adhesive layer 16 containing an adhesive component.

公开(公告)号：US20240355665A1

公开(公告)日：2024-10-24

申请号：US18683052

申请日：2022-08-09

Applicant: Resonac Corporation

Inventor： Kenta KIKUCHI ,  Hiroyuki IZAWA ,  Takashi TATSUZAWA ,  Mayumi SATO ,  Yasuo MAEHARA ,  Hiroshi TAKAIRA ,  Takahiro FUKUI ,  Katsuhiko TOMISAKA ,  Toshiaki MATSUZAKI

IPC: H01L21/683 ,  C09J7/40 ,  C09J9/02

CPC classification number: H01L21/6836 ,  C09J7/403 ,  C09J9/02 ,  C09J2203/326 ,  C09J2301/122 ,  C09J2301/18 ,  C09J2301/50 ,  H01L2221/68318 ,  H01L2221/68386

Abstract: A production method for an adhesive sheet for semiconductor device production including: preparing a backing material-attached laminated body including a laminated body and a backing material; a laminated body cutting step of making an incision in the laminated body along any cut-out shape; and a backing material peeling step of peeling the backing material from the laminated body, wherein in the backing material peeling step, a portion of the laminated body existing in a region surrounded by the incision is attached to the backing material and removed.