Assembly of electronic components onto substrates

    公开(公告)号:US5912438A

    公开(公告)日:1999-06-15

    申请号:US762639

    申请日:1996-12-09

    Applicant: Richard Kubin

    Inventor: Richard Kubin

    Abstract: In a method of assembling an electronic component onto a substrate, a fiducial is defined by a solder mask positioned upon the substrate. A fiducial-defining window in the mask has a base of the window completely provided with a material of different light-reflecting quality than the mask surface. This provides for the peripheral edge of the window, i.e. the mask, to be the edge of the fiducial. Windows in the mask which expose terminal pads upon the substrate and fixed in position relative to edges of the fiducial and both these windows and the fiducial are determined by the mask. Surface mount components are then located upon the substrate relative to the window positions and not relative to the terminal pad positions. This process reduces the number of incorrect connections of terminals of components to terminal pads.

    Assembly of electronic components onto substrates
    2.
    发明授权
    Assembly of electronic components onto substrates 失效
    将电子部件装配到基板上

    公开(公告)号:US6044549A

    公开(公告)日:2000-04-04

    申请号:US164268

    申请日:1998-10-01

    Applicant: Richard Kubin

    Inventor: Richard Kubin

    Abstract: In a method of assembling an electronic component onto a substrate, a fiducial is defined by a solder mask positioned upon the substrate. A fiducial-defining window in the mask has a base of the window completely provided with a material of different light-reflecting quality than the mask surface. This provides for the peripheral edge of the window, i.e. the mask, to be the edge of the fiducial. Windows in the mask which expose terminal pads upon the substrate and fixed in position relative to edges of the fiducial and both these windows and the fiducial are determined by the mask. Surface mount components are then located upon the substrate relative to the window positions and not relative to the terminal pad positions. This process reduces the number of incorrect connections of terminals of components to terminal pads.

    Abstract translation: 在将电子部件组装到基板上的方法中,通过位于基板上的焊接掩模限定基准。 掩模中的基准定义窗口具有窗口的底部,其完全具有与掩模表面不同的光反射质量的材料。 这提供了窗口的外围边缘,即掩模,作为基准的边缘。 通过掩模确定掩模中的窗口,其将端子衬垫暴露在衬底上并相对于基准的边缘固定在适当位置,并且这两个窗口和基准点都由掩模确定。 然后表面安装部件相对于窗口位置而不是相对于端子焊盘位置位于基板上。 该过程减少了组件端子到端子焊盘的不正确连接的数量。

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