公开(公告)号：US4882000A

公开(公告)日：1989-11-21

申请号：US177896

申请日：1988-04-01

Applicant: Risuke Ozaki

Inventor： Risuke Ozaki

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K9/00

CPC classification number: H05K3/0061 ,  H05K3/445 ,  H05K9/0039 ,  H05K1/0298 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/066 ,  H05K2203/1438 ,  H05K3/386 ,  H05K3/429 ,  Y10T29/49165 ,  Y10T29/49812

Abstract: The present invention relates to a method of manufacturing printed circuit boards.The manufacturing method of printed circuit boards under the present invention is to detach a release paper from a metal board on which holes are provided and to which the adhesive sheet and a release paper are attached. Thereafter, the metal board is glued to a resin board having at least one circuit layer and at least either of through holes or lead wire holes, by means of the adhesive sheet by pressing.An alternative manufacturing method of printed circuit boards under the present invention is to provide lead wire holes at the centers of resin filled holes in a metal board material, and to which an adhesive sheet and a release paper are attached. From the metal board material, a metal board is made by finishing its outer configuration. The release paper is detached from the metal board. Thereafter, the metal board is glued by pressing to a resin board having at least one circuit layer and at least either of through holes or lead wire holes, by means of the adhesive sheet.

Abstract translation: 本发明涉及印刷电路板的制造方法。 本发明的印刷电路板的制造方法是将剥离纸从设置有孔的金属板剥离，粘合片和剥离纸附着在该金属板上。 此后，通过压制粘合剂将金属板胶合到具有至少一个电路层和至少任一个通孔或引线孔的树脂板上。 本发明的印刷电路板的替代制造方法是在金属板材料的树脂填充孔的中心处提供引线孔，并且粘合片和剥离纸附接到该引线孔。 通过金属板材料，通过完成其外部构造来制造金属板。 脱模纸与金属板分离。 此后，借助于粘合片，将金属板通过压制粘合到具有至少一个电路层和至少任一个通孔或引线孔的树脂板上。

公开(公告)号：US4817280A

公开(公告)日：1989-04-04

申请号：US871910

申请日：1986-06-09

Applicant: Risuke Ozaki

Inventor： Risuke Ozaki

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K3/10

CPC classification number: H05K3/0061 ,  H05K3/445 ,  H05K1/0298 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2203/066 ,  H05K3/386 ,  H05K3/429 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: The present invention relates to a method of manufacturing printed circuit boards.The method of manufacturing printed circuit boards under the present invention is to provide holes on a metal plate, to attach a prepreg to the metal plate, and to fill the prepreg into the holes by heat-pressing the metal plate to which the prepreg is attached. Thereafter, lead wire holes are provided at the centers of prepreg filled the holes, and a resin plate having at least one circuit layer and through holes is glued to the metal plate. Alternately, a resin plate having at least one circuit layer and lead wire holes, or a resin plate having at least one circuit layer, through holes and lead wire holes are glued to the metal plate on the side where the prepreg is attached.

Abstract translation: 本发明涉及印刷电路板的制造方法。 本发明的制造印刷电路板的方法是在金属板上设置孔，将预浸料固定到金属板上，并通过热压预浸料坯附着的金属板将预浸料填充到孔中 。 此后，在填充孔的预浸料的中心处设置引线孔，并且具有至少一个电路层和通孔的树脂板粘合到金属板上。 或者，具有至少一个电路层和导线孔的树脂板或具有至少一个电路层，通孔和引线孔的树脂板粘合到安装有预浸料的一侧的金属板上。

公开(公告)号：US5093761A

公开(公告)日：1992-03-03

申请号：US495158

申请日：1990-03-19

Applicant: Risuke Ozaki

Inventor： Risuke Ozaki

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/09109 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2201/2009 ,  H05K2203/1438 ,  H05K3/0061 ,  H05K3/429 ,  Y10S428/901

Abstract: A circuit board device includes a flexible circuit board, a rigid circuit board bonded to at least a part of the flexible circuit board, and a metal plate bonded to at least one of the rigid circuit board and a portion of the flexible circuit board which is itself bonded to the rigid circuit board. Heat generated from components mounted on the rigid circuit board is dissipated through the metal plate to a frame, for example.

Abstract translation: 电路板装置包括柔性电路板，与柔性电路板的至少一部分结合的刚性电路板，以及与刚性电路板和挠性电路板的至少一个接合的金属板， 本身粘接到刚性电路板上。 例如，通过金属板将安装在刚性电路板上的部件产生的热量散发到框架。

公开(公告)号：US4689442A

公开(公告)日：1987-08-25

申请号：US814400

申请日：1985-12-30

Applicant: Risuke Ozaki

Inventor： Risuke Ozaki

IPC: H05K1/02 ,  B32B3/12 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/0061 ,  B32B3/12 ,  H05K3/445 ,  H05K1/0272 ,  H05K1/0298 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/1438 ,  H05K3/386 ,  H05K3/429 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present invention relates to a printed circuit board and to a method of manufacturing the same. The printed circuit board has a reinforcing panel glued to the surface of a resin board. The resin board is provided with at least one circuit layer and through holes. The reinforcing panel contains a core in a plate form and is made of at least one curved board and a metal board glued at least to one side of the core. The reinforcing panel is provided with resin holes, the resin holes are filled with resin, and a lead wire hole is provided through the center of the filled-in resin. The center line of the through hole and that of the lead wire hole are almost identical. The manufacturing method provides a lead wire hole through the center of each resin filled hole in a reinforcing panel by a drilling device assisted by a hole position designating means. Thereafter, the reinforcing panel and a resin board having at least one circuit layer and through holes are glued together keeping the center line of each through hole and that of each corresponding lead wire hole almost identical.

Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及印刷电路板及其制造方法。 印刷电路板具有胶合到树脂板的表面的加强板。 树脂板设置有至少一个电路层和通孔。 加强板包括板形的芯，并且由至少一个弯曲板和至少粘合到芯的一侧的金属板制成。 加强板设置有树脂孔，树脂孔填充有树脂，并且穿过填充树脂的中心设置有引线孔。 通孔的中心线和导线孔的中心线几乎相同。 该制造方法通过由孔位置指定装置辅助的钻孔装置提供穿过加强板中每个树脂填充孔的中心的引线孔。 此后，加强板和具有至少一个电路层和通孔的树脂板粘合在一起，保持每个通孔的中心线和每个相应的引线孔的中心线几乎相同。

公开(公告)号：US4663208A

公开(公告)日：1987-05-05

申请号：US691611

申请日：1985-01-15

Applicant: Takeshi Ninomiya ,  Risuke Ozaki

Inventor： Takeshi Ninomiya ,  Risuke Ozaki

IPC: H05K3/46 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K9/00 ,  B32B3/10 ,  B22F5/00 ,  B32B31/00

CPC classification number: H05K3/0061 ,  H05K9/0039 ,  H05K1/0298 ,  H05K2201/096 ,  H05K3/386 ,  H05K3/429 ,  H05K3/445 ,  Y10S428/901 ,  Y10T156/1056 ,  Y10T29/49165 ,  Y10T428/12361 ,  Y10T428/12396 ,  Y10T428/24331

Abstract: The present invention relates to a printed circuit board and to a method of manufacturing the same.The printed circuit board of the present invention consists of a metal board glued to a resin board which is provided with at least one circuit layer. The metal board is provided with holes which are filled with resin, and lead wire holes are provided at the centers of the resin filled holes. The resin board is provided with through holes. The center of the lead wire holes and the centers of the through holes are on identical lines.Further, the method of manufacturing a printed circuit board under the present invention is to provide resin holes on a metal board, filling the holes with resin, and providing lead wire holes at the centers of the resin filled holes. In this process, an identical hole position designating means is used for providing the resin holes and the lead wire holes. At least one circuit layer and through holes are to be provided on the resin board. Thereafter, the metal board and the resin board are glued together. In this process, the centers of the lead wire holes and the centers of the through holes are to be put on identical lines.

Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及印刷电路板及其制造方法。 本发明的印刷电路板由粘合到树脂板上的金属板组成，该树脂板设有至少一个电路层。 金属板上设有充满树脂的孔，在树脂填充孔的中心设有引线孔。 树脂板上设有通孔。 引线孔的中心和通孔的中心在同一条线上。 此外，本发明的印刷电路板的制造方法是在金属板上设置树脂孔，用树脂填充孔，在树脂填充孔的中心设置引线孔。 在该过程中，使用相同的孔位置指定装置来提供树脂孔和引线孔。 在树脂板上设置至少一个电路层和通孔。 此后，金属板和树脂板粘合在一起。 在这个过程中，引线孔的中心和通孔的中心要放在相同的线上。