LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT
    1.
    发明申请
    LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT 审中-公开
    微机电组件的层结构

    公开(公告)号:US20150232331A1

    公开(公告)日:2015-08-20

    申请号:US14624130

    申请日:2015-02-17

    Abstract: A layer structure for a micromechanical component, having: a first layer, which is usable both for an electrical wiring of the component and as electrode of the component; and a second layer which is resistant to oxide etching and is disposed below the first layer, the second layer being formed essentially in one plane.

    Abstract translation: 一种用于微机械部件的层结构,具有:第一层,其可用于部件的电线和部件的电极; 以及耐氧化物蚀刻的第二层,并且设置在第一层的下方,第二层基本上形成在一个平面中。

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