公开(公告)号：US20130104654A1

公开(公告)日：2013-05-02

申请号：US13658949

申请日：2012-10-24

Applicant: Robert Bosch GmbH

Inventor： Johannes CLASSEN ,  Arnd KAELBERER ,  Lars TEBJE

IPC: G01P15/08 ,  H05K3/00

CPC classification number: G01P15/125 ,  B81B3/0072 ,  B81B2201/025 ,  G01P15/18 ,  G01P2015/0805 ,  Y10T29/49155

Abstract: A micromechanical component includes: a substrate; a seismic weight joined to the substrate at a first suspension mount; at least one first electrode for measuring a motion of the seismic weight in a first direction, the first electrode being joined to the substrate at a second suspension mount; and at least one second electrode for measuring a motion of the seismic weight in a second direction different from the first direction, the second electrode being joined to the substrate at a third suspension mount. The first electrode is mechanically connected to the second suspension mount with the aid of a support arm and set apart from the second suspension mount.

Abstract translation: 微机械部件包括：基板; 在第一悬挂安装座处接合到所述基板的地震重量; 至少一个第一电极，用于测量所述地震重量在第一方向上的运动，所述第一电极在第二悬架安装件处连接到所述基板; 以及至少一个第二电极，用于测量在与所述第一方向不同的第二方向上的所述地震重量的运动，所述第二电极在第三悬架安装件处连接到所述基板。 借助于支撑臂​​将第一电极机械地连接到第二悬架安装座，并与第二悬架安装件分离。

公开(公告)号：US20150355217A1

公开(公告)日：2015-12-10

申请号：US14734656

申请日：2015-06-09

Applicant: Robert Bosch GmbH

Inventor： Guenther Nino-Carlo ULLRICH ,  Lars TEBJE

IPC: G01P15/097

CPC classification number: G01P15/097 ,  G01P15/125 ,  G01P2015/0831

Abstract: A micromechanical acceleration sensor is provided, including a substrate, a first seismic mass, which is movably suspended on the substrate and deflectable in an acceleration acting on the substrate in a first direction, first detection means for detecting a deflection of the first seismic mass in an acceleration acting on the substrate in the first direction, a second seismic mass, which is movably suspended on the substrate and deflectable in an acceleration acting on the substrate in a second direction, the second direction running perpendicularly to the first direction, second detection means for detecting a deflection of the second seismic mass in an acceleration acting on the substrate in the second direction, the second seismic mass furthermore being deflectable in an acceleration acting on the substrate in a third direction, the third direction running perpendicularly to the first direction and to the second direction, and third detection means for detecting a deflection of the second seismic mass in an acceleration acting on the substrate in the third direction.

Abstract translation: 提供了一种微机械加速度传感器，其包括基板，第一抗震块，其可移动地悬挂在基板上，并且以沿第一方向作用在基板上的加速度可偏转;第一检测装置，用于检测第一地震块的偏转 以第一方向作用在基板上的加速度，第二地震块，其可移动地悬挂在基板上，并且以沿第二方向作用在基板上的加速度可偏转，第二方向垂直于第一方向延伸，第二检测装置 用于在第二方向上检测作用在基板上的加速度中的第二地震质量块的偏转，第二地震块还可以沿着第三方向作用在基板上的加速度偏转，第三方向垂直于第一方向延伸， 以及第三检测装置，用于检测所述第二方向的偏转 在第三方向作用在衬底上的加速度的第二抗震质量。

公开(公告)号：US20170059321A1

公开(公告)日：2017-03-02

申请号：US15253345

申请日：2016-08-31

Applicant: Robert Bosch GmbH

Inventor： Joerg BRAEUER ,  Christian HOEPPNER ,  Lars TEBJE

IPC: G01C19/5712 ,  B81C1/00 ,  B81B3/00

Abstract: A method for manufacturing a MEMS element, including the following: forming a least one stationary weight element and at least one moving weight element in the MEMS element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.

Abstract translation: 一种用于制造MEMS元件的方法，包括以下步骤：在MEMS元件中形成至少一个固定重量元件和至少一个移动重量元件，以及将至少一个固定元件定位在固定重量元件和移动重量元件处， 固定元件形成为能够被切断。

公开(公告)号：US20150353345A1

公开(公告)日：2015-12-10

申请号：US14731695

申请日：2015-06-05

Applicant: Robert Bosch GmbH

Inventor： Friedjof HEUCK ,  Ralf REICHENBACH ,  Daniel Christoph MEISEL ,  Lars TEBJE ,  Mirko HATTASS ,  Jochen REINMUTH ,  Torsten KRAMER ,  Johannes CLASSEN ,  Reinhard NEUL ,  Antoine PUYGRANIER

IPC: B81B7/00

CPC classification number: B81B7/0016 ,  B81B7/0054 ,  B81B2207/017 ,  B81C2203/0785 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: Method for on-chip stress decoupling to reduce stresses in a vertical hybrid integrated component including MEMS and ASIC elements and to mechanical decoupling of the MEMS structure. The MEMS/ASIC elements are mounted above each other via at least one connection layer and form a chip stack. On the assembly side, at least one connection area is formed for the second level assembly and for external electrical contacting of the component on a component support. At least one flexible stress decoupling structure is formed in one element surface between the assembly side and the MEMS layered structure including the stress-sensitive MEMS structure, in at least one connection area to the adjacent element component of the chip stack or to the component support, the stress decoupling structure being configured so that the connection material does not penetrate into the stress decoupling structure and flexibility of the stress decoupling structure is ensured.

Abstract translation: 用于片上应力去耦的方法，以减少包括MEMS和ASIC元件在内的垂直混合集成组件中的应力以及MEMS结构的机械解耦。 MEMS / ASIC元件经由至少一个连接层彼此上方安装并形成芯片堆叠。 在组装侧上，形成用于第二级组件的至少一个连接区域以及用于部件支撑件上的部件的外部电接触。 至少一个柔性应力解耦结构形成在组件侧和MEMS分层结构之间的一个元件表面中，包括应力敏感MEMS结构，至少与芯片堆叠的相邻元件部件的连接区域或组件支撑件 应力解耦结构被构造成使得连接材料不会渗透到应力解耦结构中，并且确保了应力解耦结构的柔性。