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    Heating element
    2.
    发明授权
    Heating element 失效
    加热元件

    公开(公告)号：US4272673A

    公开(公告)日：1981-06-09

    申请号：US30637

    申请日：1979-04-16

    Applicant: Daniel Semanaz ,  Robert Cassat

    Inventor： Daniel Semanaz ,  Robert Cassat

    IPC: H05B3/20 ,  H01B3/30 ,  H01B3/48 ,  H05B3/16 ,  H05B3/36

    CPC classification number: H01B3/48 ,  H01B3/306 ,  H05B3/16

    Abstract: A heating element is comprised of [A] a shaped, electrically insulating substrate, said substrate including a reinforced polyimide composite, [B] a continuous, electric resistor element in entwining relationship with, and at least partially inlain within said composite [A], said electric resistor element being coated with a thermostable electrically insulating coating, and [C] means for coupling said electric resistor element [B] with an electric power source. Techniques for the fabrication of such heating elements are also disclosed.

    Abstract translation: 加热元件由[A]成形的电绝缘基底构成，所述基底包括增强的聚酰亚胺复合物，[B]与所述复合材料[A]中的缠绕关系并且至少部分地在一个内部的连续的电阻元件， 所述电阻元件涂覆有耐热电绝缘涂层，[C]用于将所述电阻元件[B]与电源耦合的装置。 还公开了用于制造这种加热元件的技术。

    Forming of thick-layer, hybrid electronic printed circuits
    3.
    发明授权
    Forming of thick-layer, hybrid electronic printed circuits 失效
    形成厚层，混合电子印刷电路

    公开(公告)号：US4517227A

    公开(公告)日：1985-05-14

    申请号：US441153

    申请日：1982-11-12

    Applicant: Robert Cassat

    Inventor： Robert Cassat

    IPC: H01C17/06 ,  H01B1/16 ,  H01L21/70 ,  H01L27/01 ,  H05K1/09 ,  H05K1/16 ,  H05K3/10 ,  H05K3/46 ,  B05D5/12

    CPC classification number: H05K3/105 ,  H01B1/16 ,  H01L21/705 ,  H05K1/097 ,  H05K2203/1157 ,  H05K2203/125

    Abstract: Thick-layer hybrid electronic printed circuits are formed by printing predetermined circuit pattern onto an insulating substrate by deposition of predetermined ink pattern thereupon, advantageously by silk-screening or masking, and then baking said ink circuit pattern, and repeating the deposition/baking steps as required, the subject forming process featuring use of an insulating ink comprising a non-conductive metallic oxide extender, desirably cuprous oxide, which ink is thus either potentially conductive or potentially resistive, and the development of such conductivity or resistivity, after baking, by treating the ink pattern with a reducing agent, desirably a borohydride, as to readily and quantitatively convert said metal oxide into a conducting metal.

    Abstract translation: 厚层混合电子印刷电路通过将预定的电路图案沉积在绝缘基板上而形成，有利地通过丝网印刷或掩模沉积预定的墨水图案，然后烘烤所述墨水回路图案，并将沉积/烘烤步骤重复 需要的是，使用包含非导电性金属氧化物增量剂（优选氧化亚铜）的绝缘油墨的主题成型工艺，该油墨因此具有潜在的导电性或潜在的电阻性，并且在烘烤后通过处理 油墨图案用还原剂，理想的是硼氢化物，以容易且定量地将所述金属氧化物转化为导电金属。

    Composite article and method for making same
    5.
    发明授权
    Composite article and method for making same 失效
    复合制品及其制作方法

    公开(公告)号：US5904954A

    公开(公告)日：1999-05-18

    申请号：US722093

    申请日：1996-10-17

    Applicant: Robert Cassat ,  Jean-Paul Faure

    Inventor： Robert Cassat ,  Jean-Paul Faure

    IPC: B32B5/28 ,  B32B5/24 ,  B32B15/08 ,  B32B27/36 ,  H05K1/00 ,  H05K1/03 ,  H05K3/06 ,  B05D1/14

    CPC classification number: B32B5/24 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0236 ,  H05K2201/0278 ,  Y10T428/23943 ,  Y10T428/23986

    Abstract: A composite material and a method for making same are disclosed. A composite article including an electrically and/or thermally insulating substrate and protective layers on each side thereof is particularly disclosed. Said material includes protective layers consisting of fibers of a heat-stable material flocked onto the insulating substrate, and heat-stable coating resin. The resulting protective layer has improved protective properties, particularly moisture-proofness. The composite material may also be used as a metal layer carrier for forming flexible printed electrical circuits.

    Abstract translation: PCT No.PCT / FR95 / 00505 Sec。 371日期1996年10月17日第 102（e）日期1996年10月17日PCT提交1995年4月18日PCT公布。 公开号WO95 / 28278 日期：1995年10月26日公开了一种复合材料及其制造方法。 特别公开了一种复合制品，其包括电隔离和/或隔热基板及其每侧的保护层。 所述材料包括由嵌入到绝缘基板上的热稳定材料的纤维构成的保护层和热稳定的涂布树脂。 所得到的保护层具有改进的保护性能，特别是防潮性。 复合材料也可以用作用于形成柔性印刷电路的金属层载体。

    Metallization of electrically insulating polyimide/aromatic polyamide film substrates
    7.
    发明授权
    Metallization of electrically insulating polyimide/aromatic polyamide film substrates 失效
    电绝缘聚酰亚胺/芳香族聚酰胺薄膜基材的金属化

    公开(公告)号：US4565606A

    公开(公告)日：1986-01-21

    申请号：US600457

    申请日：1984-04-16

    Applicant: Robert Cassat

    Inventor： Robert Cassat

    IPC: C23C18/30 ,  C25D5/56 ,  H05K3/18

    CPC classification number: C25D5/56 ,  H05K3/188 ,  Y10T428/12569 ,  Y10T428/31721

    Abstract: Electrically insulating polyimide/aromatic polyamide film substrates are conductively metallized, e.g., to provide highly thermally stable base members useful in the fabrication of printed circuits and the like, by (1) shaping into such essentially thermosetting film substrate an intimate homogeneous admixture of a film-forming polyimide/aromatic polyamide matrix having from 20 to 60 percent by total weight of said admixture of finely divided, non-conductive metal oxide particles uniformly distributed therein, (2) disrupting at least one face surface of said shaped film substrate to expose thereon a plurality of said finely divided, non-conductive metal oxide particles, (3) treating said at least one disrupted face surface with a preferably borohydride reducing agent to reduce said exposed metal oxide particles into a layer of electrically conductive free metal, whereby said at least one surface is rendered electrically conductive, and, advantageously, (4) electrolytically depositing a reinforcing, electrically conductive metallic overlayer atop said first layer of electrically conductive free metal.

    Abstract translation: 电绝缘性聚酰亚胺/芳香族聚酰胺薄膜基材是电导性金属化的，例如，通过（1）将这种基本上热固化的薄膜基材成形为薄膜的均匀均匀混合物，以提供用于制造印刷电路等的高度热稳定的基底部件 所述聚酰亚胺/芳族聚酰胺基质的总重量为均匀分布在其中的细分散的非导电金属氧化物颗粒的总重量的20-60％，（2）破坏所述成形薄膜基材的至少一个表面以在其上露出 多个所述细分的非导电金属氧化物颗粒，（3）用优选硼氢化还原剂处理所述至少一个破裂的表面，以将所述暴露的金属氧化物颗粒减少到导电的游离金属层中，由此所述 至少一个表面被导电，并且有利地，（4）电解沉积a 在所述第一层导电自由金属上方的加强导电金属覆层。

    Metallizing of plastic substrata
    9.
    发明授权
    Metallizing of plastic substrata 失效
    金属化塑料基材

    公开(公告)号：US4590115A

    公开(公告)日：1986-05-20

    申请号：US449183

    申请日：1982-12-13

    Applicant: Robert Cassat

    Inventor： Robert Cassat

    IPC: C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  C23C18/44 ,  C23C18/50 ,  C25D5/56 ,  H05K3/18

    CPC classification number: C25D5/56 ,  C23C18/1641 ,  C23C18/2013 ,  C23C18/206 ,  H05K3/188 ,  Y10T428/24628

    Abstract: Plastic substrata are metallized, preferably by direct electrolytic metallization, by (i) providing a plastic shaped article comprising intimate admixture of a polymeric resin and a plurality of small metallic filler particles of a non-conductive oxide of a non-noble metal uniformly dispersed therethrough, at least one of the face surfaces of said shaped article having exposed thereon such high density of said metallic filler particles as to provide in step (ii) metallization growth nuclei adapted for direct electrolytic metallization; (ii) next subjecting said at least one face surface of said plastic shaped article to the action of a reducing agent to essentially quantitatively convert the non-conductive metal oxide filler particles to conductive free metal, metallization growth nuclei; and (iii) thence electrochemically and/or electrolytically metallizing the at least one reduced face surface of said plastic shaped article with a free metal deposit.

    Abstract translation: 通过（i）提供塑料成型制品，其包括聚合物树脂和非均匀分散在其中的非贵金属的非导电氧化物的多个小的金属填料颗粒，包括聚合物树脂的密集混合物，塑性基质金属化，优选通过直接电解金属化 所述成形制品的至少一个表面在其上暴露有如此高密度的所述金属填料颗粒，以在步骤（ii）中提供适于直接电解金属化的金属化生长核; （ii）接下来经历所述塑料成型制品的所述至少一个表面表面的还原剂的作用以基本上定量地将非导电金属氧化物填料颗粒转化为导电的游离金属，金属化生长核; 和（iii）然后用游离金属沉积物电化学和/或电解金属化所述塑料成形制品的至少一个还原表面。

    Metallization of electrically insulating polymeric film substrates
    10.
    发明授权
    Metallization of electrically insulating polymeric film substrates 失效
    电绝缘聚合物薄膜基材的金属化

    公开(公告)号：US4564424A

    公开(公告)日：1986-01-14

    申请号：US600833

    申请日：1984-04-16

    Applicant: Robert Cassat ,  Maurice Alliot-Lugaz

    Inventor： Robert Cassat ,  Maurice Alliot-Lugaz

    IPC: B32B15/08 ,  B32B15/088 ,  C08K3/22 ,  C08L67/00 ,  C08L67/02 ,  C08L71/12 ,  C08L77/00 ,  C08L79/04 ,  C08L81/02 ,  C08L101/00 ,  C23C18/20 ,  C23C18/22 ,  C23C18/31 ,  C25D5/56 ,  H05K3/06 ,  H05K3/18

    CPC classification number: H05K3/188 ,  C25D5/56 ,  Y10T428/12569 ,  Y10T428/31504

    Abstract: Electrically insulating polymeric film substrates are conductively metallized, e.g., to provide base members useful in the fabrication of printed circuits and the like, by (1) shaping into such film substrate an intimate homogeneous admixture of a film-forming polymer matrix having from 10 to 70 percent by total weight of said admixture of finely divided, non-conductive metal oxide particles uniformly distributed therein, (2) disrupting at least one face surface of said shaped film substrate to expose thereon a plurality of said finely divided, non-conductive metal oxide particles, (3) treating said at least one disrupted face surface with a preferably borohydride reducing agent to reduce said exposed metal oxide particles into a layer of electrically conductive free metal, whereby said at least one face surface is rendered electrically conductive, and, advantageously, (4) eletrolytically depositing a reinforcing, electrically conductive metallic overlayer atop said first layer of electrically conductive free metal.

    Abstract translation: 电绝缘性聚合物膜基材是导电金属化的，例如，通过（1）将这种成膜聚合物基质的均匀混合物形成为具有10至10的成膜聚合物基质，从而提供用于制造印刷电路等的基底部件 均匀分布在其中的所述细分散的非导电性金属氧化物颗粒的混合物的总重量的70重量％，（2）破坏所述成形薄膜基材的至少一个表面以在其上暴露多个所述细碎的非导电金属 氧化物颗粒，（3）用优选硼氢化还原剂处理所述至少一个破坏的面表面，以将所述暴露的金属氧化物颗粒减少为导电的自由金属层，由此所述至少一个面表面导电， 有利地，（4）电解沉积在所述第一层电极上方的增强导电金属覆层 导电性无源金属。

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