公开(公告)号：US06541076B2

公开(公告)日：2003-04-01

申请号：US09742877

申请日：2000-12-20

Applicant: Robert Dunkle

Inventor： Robert Dunkle

IPC: B05D100

CPC classification number: B05D7/546 ,  B05D1/045 ,  B05D3/067 ,  B05D7/02 ,  C09D4/00 ,  C09D5/24 ,  Y10T428/31504 ,  Y10T428/31855 ,  C08F222/20

Abstract: A method of priming a sheet molding compound (SMC) part. The method includes applying a photopolymerizable priming composition to a surface of the SMC part. The priming composition includes a polymerizable component, a photoinitiating component, and a conductive component. The method also includes irradiating the priming composition with light to initiate a polymerization reaction. The priming composition polymerizes on the SMC part substantially without releasing volatile solvents.

Abstract translation: 一种引发片状模塑料（SMC）部分的方法。 该方法包括将可光聚合的起泡组合物施加到SMC部件的表面上。 起动组合物包括可聚合组分，光引发组分和导电组分。 该方法还包括用光照射引发组合物以引发聚合反应。 起动组合物在SMC部分上聚合基本上不释放挥发性溶剂。