公开(公告)号：US20070002599A1

公开(公告)日：2007-01-04

申请号：US10546924

申请日：2003-02-28

Applicant: Robin Caven

Inventor： Robin Caven

IPC: H02M1/00

CPC classification number: H05K7/20518 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/181 ,  H05K2201/09972 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2203/1572 ,  Y02P70/611

Abstract: The present invention relates to a circuit board of DSLAM and an arrangement to minimize thermal flow or electro-magnetic radiation from digital side to analog side, or vice versa. The circuit board comprises analog components and passive digital components on first side of the circuit board and active digital components on the second side of the circuit board. The arrangement comprises an enclosure having the circuit board with analog components, passive digital components, and active digital components and a first component connected between the first portion and the second portion of the circuit board to restrict thermal flow or electromagnetic radiation from one portion to another portion.

Abstract translation: 本发明涉及一种DSLAM的电路板以及用于使从数字侧到模拟侧的热流或电磁辐射最小化的布置，反之亦然。 电路板包括电路板第一面上的模拟部件和无源数字部件以及电路板第二面上的有源数字部件。 该装置包括具有模拟部件的电路板，无源数字部件和有源数字部件的壳体以及连接在电路板的第一部分和第二部分之间的第一部件，以限制从一个部分到另一个部分的热流或电磁辐射 一部分。