公开(公告)号：US20180162968A1

公开(公告)日：2018-06-14

申请号：US15790606

申请日：2017-10-23

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charles R. Kinzie ,  Daniel Greene ,  Christopher Gilmore ,  James F. Cameron ,  Ping Ding ,  Qing Min Wang ,  Young-Seok Kim

IPC: C08F32/06 ,  C08L45/00

CPC classification number: C08F32/06 ,  C07C49/537 ,  C08G61/10 ,  C08G61/12 ,  C08G2261/135 ,  C08G2261/1426 ,  C08G2261/312 ,  C08G2261/46 ,  C08G2261/64 ,  C08G2261/65 ,  C08G2261/76 ,  C08L45/00 ,  C08L65/02 ,  C08L67/03 ,  C09D165/02 ,  H01L23/5329

Abstract: Certain cyclopentadienone monomers having polar moieties are useful in forming polyarylene resins having improved solubility in certain organic solvents and are useful in forming polyarylene resin layers in electronics applications.

公开(公告)号：US20210198396A1

公开(公告)日：2021-07-01

申请号：US17113147

申请日：2020-12-07

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Jaclyn Murphy ,  Colin Hayes ,  Michael K. Gallagher ,  Kristen Flajslik ,  Charles R. Kinzie ,  Colin Calabrese ,  Qing Min Wang

IPC: C08F212/32 ,  C08F2/06 ,  C08F236/04 ,  C08K5/3415 ,  B05D7/24

Abstract: The present disclosure relates to a chemical composition produced from polymerizing an arylcyclobutene monomer, and a bismaleimide compound as a cross-linker; and its use, especially in electronic devices.

公开(公告)号：US10894848B2

公开(公告)日：2021-01-19

申请号：US15790606

申请日：2017-10-23

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charles R. Kinzie ,  Daniel Greene ,  Christopher Gilmore ,  James F. Cameron ,  Ping Ding ,  Qing Min Wang ,  Young-Seok Kim

IPC: C07C49/537 ,  C08F32/06 ,  C08L45/00 ,  C08G61/10 ,  C08G61/12 ,  C08L67/03 ,  H01L23/532 ,  C09D165/02 ,  C08L65/02

Abstract: Certain cyclopentadienone monomers having polar moieties are useful in forming polyarylene resins having improved solubility in certain organic solvents and are useful in forming polyarylene resin layers in electronics applications.

公开(公告)号：US20240317940A1

公开(公告)日：2024-09-26

申请号：US18187072

申请日：2023-03-21

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC ,  DUPONT ELECTRONICS, INC.

Inventor： Nora Sabina Radu ,  Jaclyn Murphy ,  Chai Kit Ngai ,  Greg A. Hostetler ,  Qing Min Wang ,  Tao Huang ,  Anton Li ,  Tanya N. Singh-Rachford

IPC: C08G73/10 ,  C08G73/12 ,  C08J5/18 ,  C09D7/47 ,  C09D7/63 ,  C09D179/08 ,  H05K1/03 ,  H05K3/18

CPC classification number: C08G73/1042 ,  C08G73/1017 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/1071 ,  C08G73/127 ,  C08J5/18 ,  C09D7/47 ,  C09D7/63 ,  C09D179/085 ,  H05K1/0346 ,  H05K3/18 ,  C08J2379/08 ,  H05K2201/0154

Abstract: There is provided a soluble polyimide resin comprising: (a) one or more tetracarboxylic acid component residues: (b) one or more diamine component residues; and (c) one or more endcapping compounds; wherein: the one or more endcapping compounds comprise one or more crosslinking groups. The soluble polyimide resin can be used in electronics applications.

公开(公告)号：US20180171069A1

公开(公告)日：2018-06-21

申请号：US15814477

申请日：2017-11-16

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Qing Min Wang ,  Elizabeth K. Michael-Sapia ,  Christopher Gilmore ,  Ping Ding ,  Young-Seok Kim

IPC: C08G61/12 ,  C09D165/02

CPC classification number: C08G61/128 ,  C08G61/10 ,  C08G61/12 ,  C08G2261/135 ,  C08G2261/1426 ,  C08G2261/228 ,  C08G2261/312 ,  C08G2261/46 ,  C08G2261/64 ,  C08G2261/65 ,  C08G2261/76 ,  C08L65/02 ,  C09D165/02 ,  H01L21/02118 ,  H01L21/02282 ,  H01L23/145 ,  H01L23/5329

Abstract: Polyarylene polymers formed from an aromatic dialkyne monomer having a solubility enhancing moiety and having relatively high weight average molecular weights and a relatively low polydispersity show improved solubility in certain organic solvents and are useful in forming relatively thick dielectric material layers in a single coating step.

公开(公告)号：US20240317985A1

公开(公告)日：2024-09-26

申请号：US18187201

申请日：2023-03-21

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC ,  DUPONT ELECTRONICS, INC.

Inventor： Colin Hayes ,  Anton Chavez ,  Nora Sabina Radu ,  Jaclyn Murphy ,  Qing Min Wang ,  Tao Huang ,  Anton Li ,  Tanya N. Singh-Rachford ,  Michael Gallagher

IPC: C08L23/20 ,  C08K5/5399 ,  C08L77/10 ,  C08L79/08

CPC classification number: C08L23/20 ,  C08K5/5399 ,  C08L77/10 ,  C08L79/08 ,  C08L2203/16

Abstract: There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.