公开(公告)号：US12099300B2

公开(公告)日：2024-09-24

申请号：US16598264

申请日：2019-10-10

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Sheng Liu ,  James F. Cameron ,  Shintaro Yamada ,  Iou-Sheng Ke ,  Keren Zhang ,  Daniel Greene ,  Paul J. LaBeaume ,  Li Cui ,  Suzanne M. Coley

IPC: G03F7/11 ,  G03F7/075 ,  G03F7/09 ,  G03F7/20

CPC classification number: G03F7/11 ,  G03F7/0752 ,  G03F7/091 ,  G03F7/2016

Abstract: Compounds having three or more alkynyl moieties substituted with an aromatic moiety having one or more of certain substituents are useful in forming underlayers useful in semiconductor manufacturing processes.

公开(公告)号：US20180162968A1

公开(公告)日：2018-06-14

申请号：US15790606

申请日：2017-10-23

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charles R. Kinzie ,  Daniel Greene ,  Christopher Gilmore ,  James F. Cameron ,  Ping Ding ,  Qing Min Wang ,  Young-Seok Kim

IPC: C08F32/06 ,  C08L45/00

CPC classification number: C08F32/06 ,  C07C49/537 ,  C08G61/10 ,  C08G61/12 ,  C08G2261/135 ,  C08G2261/1426 ,  C08G2261/312 ,  C08G2261/46 ,  C08G2261/64 ,  C08G2261/65 ,  C08G2261/76 ,  C08L45/00 ,  C08L65/02 ,  C08L67/03 ,  C09D165/02 ,  H01L23/5329

Abstract: Certain cyclopentadienone monomers having polar moieties are useful in forming polyarylene resins having improved solubility in certain organic solvents and are useful in forming polyarylene resin layers in electronics applications.

公开(公告)号：US20210397093A1

公开(公告)日：2021-12-23

申请号：US17370541

申请日：2021-07-08

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charlotte A. Cutler ,  Li Cui ,  Shintaro Yamada ,  Paul J. LaBeaume ,  Suzanne M. Coley ,  James F. Cameron ,  Daniel Greene

IPC: G03F7/11 ,  C08F230/08 ,  G03F7/16 ,  G03F7/32 ,  G03F7/20 ,  G03F7/42 ,  G03F7/075

Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.

公开(公告)号：US20210247695A1

公开(公告)日：2021-08-12

申请号：US17245326

申请日：2021-04-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Sheng Liu ,  James F. Cameron ,  Shintaro Yamada ,  Iou-Sheng Ke ,  Keren Zhang ,  Daniel Greene ,  Paul J. LaBeaume ,  Li Cui ,  Suzanne M. Coley

IPC: G03F7/11 ,  C09D5/00 ,  G03F7/075

Abstract: Compounds having three or more alkynyl moieties substituted with an aromatic moiety having one or more of certain substituents are useful in forming underlayers useful in semiconductor manufacturing processes.

公开(公告)号：US20190146346A1

公开(公告)日：2019-05-16

申请号：US16167568

申请日：2018-10-23

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： James F. Cameron ,  Keren Zhang ,  Li Cui ,  Daniel Greene ,  Shintaro Yamada

IPC: G03F7/20 ,  C08G61/10 ,  C08G61/12

Abstract: A method of manufacturing a semiconductor device comprising: providing a semiconductor device substrate having a relief image on a surface of the substrate, the relief image having a plurality of gaps to be filled; applying a coating composition to the relief image to provide a coating layer, wherein the coating composition comprises (i) a polyarylene oligomer comprising as polymerized units one or more first monomers having two or more cyclopentadienone moieties and one or more second monomers having an aromatic moiety and two or more alkynyl moieties; wherein the polyarylene oligomer has a Mw of 1000 to 6000 Da, a PDI of 1 to 2, and a molar ratio of total first monomers to total second monomers of 1:>1; and (ii) one or more organic solvents; curing the coating layer to form a polyarylene film; patterning the polyarylene film; and transferring the pattern to the semiconductor device substrate.

公开(公告)号：US11733609B2

公开(公告)日：2023-08-22

申请号：US17370541

申请日：2021-07-08

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charlotte A. Cutler ,  Li Cui ,  Shintaro Yamada ,  Paul J. LaBeaume ,  Suzanne M. Coley ,  James F. Cameron ,  Daniel Greene

IPC: G03F7/075 ,  G03F7/11 ,  G03F7/16 ,  G03F7/32 ,  G03F7/20 ,  G03F7/42 ,  C08F230/08 ,  C09D143/04 ,  C08F220/18

CPC classification number: G03F7/0752 ,  C08F230/08 ,  C08F230/085 ,  G03F7/11 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/322 ,  G03F7/423 ,  C08F220/1804 ,  C08F2800/10 ,  C09D143/04 ,  C08F220/1804 ,  C08F230/085

Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.

公开(公告)号：US11042093B2

公开(公告)日：2021-06-22

申请号：US16167568

申请日：2018-10-23

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： James F. Cameron ,  Keren Zhang ,  Li Cui ,  Daniel Greene ,  Shintaro Yamada

IPC: G03F7/20 ,  C08G61/10 ,  G03F7/09

Abstract: A method of manufacturing a semiconductor device comprising: providing a semiconductor device substrate having a relief image on a surface of the substrate, the relief image having a plurality of gaps to be filled; applying a coating composition to the relief image to provide a coating layer, wherein the coating composition comprises (i) a polyarylene oligomer comprising as polymerized units one or more first monomers having two or more cyclopentadienone moieties and one or more second monomers having an aromatic moiety and two or more alkynyl moieties; wherein the polyarylene oligomer has a Mw of 1000 to 6000 Da, a PDI of 1 to 2, and a molar ratio of total first monomers to total second monomers of 1:>1; and (ii) one or more organic solvents; curing the coating layer to form a polyarylene film; patterning the polyarylene film; and transferring the pattern to the semiconductor device substrate.

公开(公告)号：US10894848B2

公开(公告)日：2021-01-19

申请号：US15790606

申请日：2017-10-23

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charles R. Kinzie ,  Daniel Greene ,  Christopher Gilmore ,  James F. Cameron ,  Ping Ding ,  Qing Min Wang ,  Young-Seok Kim

IPC: C07C49/537 ,  C08F32/06 ,  C08L45/00 ,  C08G61/10 ,  C08G61/12 ,  C08L67/03 ,  H01L23/532 ,  C09D165/02 ,  C08L65/02

Abstract: Certain cyclopentadienone monomers having polar moieties are useful in forming polyarylene resins having improved solubility in certain organic solvents and are useful in forming polyarylene resin layers in electronics applications.

公开(公告)号：US20190146343A1

公开(公告)日：2019-05-16

申请号：US16133739

申请日：2018-09-18

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charlotte A Cutler ,  Li Cui ,  Shintaro Yamada ,  Paul J. LaBeaume ,  Suzanne M. Coley ,  James F. Cameron ,  Daniel Greene

IPC: G03F7/11 ,  C09D143/04 ,  C08F230/08 ,  G03F7/16 ,  G03F7/32 ,  G03F7/20 ,  G03F7/42

Abstract: Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.