公开(公告)号：US20170269325A1

公开(公告)日：2017-09-21

申请号：US15073212

申请日：2016-03-17

Applicant: Rosemount Aerospace Inc.

Inventor： Tim DeAngelo

IPC: G02B7/00 ,  F41G7/00

CPC classification number: G02B7/00 ,  F41G7/00 ,  F41G7/2293 ,  F42B30/006 ,  G02B7/007 ,  G02B7/02 ,  G02B7/021 ,  G02B7/025

Abstract: An optical assembly for high-G application includes an optical element formed from a brittle material. A rigid frame with a channel surrounds the outer diameter region of the optical element. A compliant material fills the space between the rigid frame and the outer diameter region of the optical element to prevent physical contact between the rigid frame and optical element during a high-G event.

公开(公告)号：US10276954B2

公开(公告)日：2019-04-30

申请号：US16135247

申请日：2018-09-19

Applicant: Rosemount Aerospace Inc.

Inventor： Tim DeAngelo

IPC: H01R12/58 ,  H05K3/00 ,  H05K1/14 ,  H05K3/46 ,  H01R43/20 ,  H05K3/36 ,  H01R12/52 ,  H05K1/11

Abstract: A circuit card assembly includes a first printed wiring board with a first receiving feature and a trace attached to the first printed wiring board. The three dimensional trace is formed by layer-by-layer additive manufacturing. The three dimensional trace includes first and second ends. The first end of the three dimensional trace engages with the first receiving feature of the first printed wiring board. The second end of the three dimensional trace is configured to engage with a second printed wiring board.

公开(公告)号：US20180337474A1

公开(公告)日：2018-11-22

申请号：US15601362

申请日：2017-05-22

Applicant: Rosemount Aerospace Inc.

Inventor： Tim DeAngelo

IPC: H01R12/58 ,  H01R43/20 ,  H05K3/46 ,  H05K1/14 ,  H05K3/36 ,  H05K3/00

Abstract: A circuit card assembly includes a first printed wiring board with a first receiving feature and a trace attached to the first printed wiring board. The three dimensional trace is formed by layer-by-layer additive manufacturing. The three dimensional trace includes first and second ends. The first end of the three dimensional trace engages with the first receiving feature of the first printed wiring board. The second end of the three dimensional trace is configured to engage with a second printed wiring board.

公开(公告)号：US20190020130A1

公开(公告)日：2019-01-17

申请号：US16135247

申请日：2018-09-19

Applicant: Rosemount Aerospace Inc.

Inventor： Tim DeAngelo

IPC: H01R12/58 ,  H05K3/00 ,  H05K1/14 ,  H05K3/46 ,  H01R43/20 ,  H05K3/36

Abstract: A circuit card assembly includes a first printed wiring board with a first receiving feature and a trace attached to the first printed wiring board. The three dimensional trace is formed by layer-by-layer additive manufacturing. The three dimensional trace includes first and second ends. The first end of the three dimensional trace engages with the first receiving feature of the first printed wiring board. The second end of the three dimensional trace is configured to engage with a second printed wiring board.

公开(公告)号：US10135159B1

公开(公告)日：2018-11-20

申请号：US15601362

申请日：2017-05-22

Applicant: Rosemount Aerospace Inc.

Inventor： Tim DeAngelo

IPC: H01R12/58 ,  H05K3/46 ,  H05K3/36 ,  H01R43/20 ,  H01R3/00 ,  H05K1/14 ,  H05K3/00

CPC classification number: H01R12/58 ,  H01R12/52 ,  H01R43/205 ,  H05K1/11 ,  H05K1/144 ,  H05K1/145 ,  H05K3/007 ,  H05K3/366 ,  H05K3/368 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325

Abstract: A circuit card assembly includes a first printed wiring board with a first receiving feature and a trace attached to the first printed wiring board. The three dimensional trace is formed by layer-by-layer additive manufacturing. The three dimensional trace includes first and second ends. The first end of the three dimensional trace engages with the first receiving feature of the first printed wiring board. The second end of the three dimensional trace is configured to engage with a second printed wiring board.