Non-light-emitting, variable transmission device and a process of fabricating the same

    公开(公告)号:US11567384B2

    公开(公告)日:2023-01-31

    申请号:US16192876

    申请日:2018-11-16

    Abstract: A non-light-emitting, variable transmission device can include a first substrate, a first transparent conductive layer, an electrochromic layer, a second transparent conductive layer, a second substrate; and an interlayer disposed between the first substrate and the second substrate. The non-light-emitting, variable transmission device is configured such that a failure of the non-light-emitting, variable transmission device is less likely than another non-light-emitting, variable transmission device in which the interlayer directly contacts the second transparent conductive layer and has a moisture content of at least 0.08 wt %. In an embodiment, the interlayer has a moisture content of at most 0.05 wt %. In another embodiment, the non-light emitting, variable transmission device further includes a barrier layer disposed between the second transparent conductive layer and the interlayer, wherein the barrier layer extends at least partly through the second transparent conductive layer or seals off a passageway.

    ELECTRICAL DEVICE INCLUDING A SUBSTRATE AND A TRANSPARENT CONDUCTIVE LAYER AND A PROCESS OF FORMING THE SAME

    公开(公告)号:US20180252976A1

    公开(公告)日:2018-09-06

    申请号:US15905175

    申请日:2018-02-26

    Abstract: A stack of layers can be formed adjacent to a substrate before any layer within the stack is patterned. In an embodiment, combinations of substrates and stacks can be made and stored for an extended period, such as more than a week or a month, or shipped to a remote location before further manufacturing occurs. By delaying irreversible patterning until the closer to the date final product will be shipped to a customer, the likelihood of having too much inventory of a particular size or having to scrap windows for a custom order that was cancelled after manufacturing started can be substantially reduced. Further, particles between layers of the stack can be avoided. The process flows described are flexible, and many of the patterning operations in forming holes, openings, or the high resistance region can be performed in many different orders.

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