公开(公告)号：US20180301368A1

公开(公告)日：2018-10-18

申请号：US15921996

申请日：2018-03-15

Applicant: SAMCO INC.

Inventor： Tomoyuki NONAKA ,  Akimi UCHIDA

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/67

Abstract: A wafer processing device is a device for handling a framed wafer including a frame, a film stretched inside the frame, and a wafer attached on the film, to perform a plasma processing on the wafer. The device includes: a wafer stage on which the wafer is to be placed via the film; a plurality of vertically movable frame-lifting pins arranged around the wafer stage, for supporting the frame; and a frame-lifting-pin drive controller for lowering the individual frame-lifting pins with different timings. With this device, the film with the attached wafer can be neatly placed on the wafer stage (i.e. with no wrinkle in the film as well as no bubble between the film and the wafer stage).