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公开(公告)号：US20190381744A1
公开(公告)日：2019-12-19
申请号：US16489326
申请日：2018-02-08
Applicant: SAMCO INC.
Inventor： Hirokazu TERAI , Risa FUNAHASHI , Tomoyasu NISHIMIYA
IPC: B29C65/00
Abstract: A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.
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公开(公告)号：US20180301368A1
公开(公告)日：2018-10-18
申请号：US15921996
申请日：2018-03-15
Applicant: SAMCO INC.
Inventor： Tomoyuki NONAKA , Akimi UCHIDA
IPC: H01L21/687 , H01L21/683 , H01L21/67
Abstract: A wafer processing device is a device for handling a framed wafer including a frame, a film stretched inside the frame, and a wafer attached on the film, to perform a plasma processing on the wafer. The device includes: a wafer stage on which the wafer is to be placed via the film; a plurality of vertically movable frame-lifting pins arranged around the wafer stage, for supporting the frame; and a frame-lifting-pin drive controller for lowering the individual frame-lifting pins with different timings. With this device, the film with the attached wafer can be neatly placed on the wafer stage (i.e. with no wrinkle in the film as well as no bubble between the film and the wafer stage).
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公开(公告)号：US20150355016A1
公开(公告)日：2015-12-10
申请号：US14730762
申请日：2015-06-04
Applicant: SAMCO INC.
Inventor： Kiyoshi HASEGAWA , Hiroshi KAWAMURA , Peter WOOD
CPC classification number: G01J1/0238 , G01J1/4257 , G01N21/55 , G01N2021/8427 , G01N2201/025 , G01N2201/1087
Abstract: The present invention provides a light beam measuring instrument that can securely receive light reflected by a sample. The light beam measuring instrument 1 includes an optical axis tilting mechanism 13 that includes a first tilting mechanism 131 and a second tilting mechanism 132. From the optical axis A1 of irradiation light beam emitted from a light beam source 112, the first tilting mechanism 131 tilts the optical axis A1 about the first tilting axis T1. The second tilting mechanism 132 tilts the optical axis A1 about the second tilting axis T2. The light beam measuring instrument 1 can receive the light reflected by the semiconductor chip C by means of operation of the optical axis tilting mechanism 13 even if the light reflected by the semiconductor chip C is tilted. Accordingly, this apparatus can securely perform measurement or inspection using the light beam.
Abstract translation: 本发明提供了一种可以安全地接收由样品反射的光的光束测量仪器。 光束测量仪1包括光轴倾斜机构13，其包括第一倾斜机构131和第二倾斜机构132.从光束源112发射的照射光束的光轴A1，第一倾斜机构131倾斜 围绕第一倾斜轴线T1的光轴A1。 第二倾斜机构132围绕第二倾斜轴T2倾斜光轴A1。 即使由半导体芯片C反射的光倾斜，光束测量仪器1也可以通过光轴倾斜机构13的操作来接收由半导体芯片C反射的光。 因此，该装置可以可靠地执行使用光束的测量或检查。
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公开(公告)号：US20250164210A1
公开(公告)日：2025-05-22
申请号：US18952498
申请日：2024-11-19
Applicant: First Samco, Inc.
Inventor： Ira Block
IPC: F41C27/00 , A61B17/132
Abstract: A tourniquet holster is designed to attach to the underside of a rifle stock, particularly for the AR-15 platform and provides easy and rapid access to a tourniquet in emergency situations without hindering the function or operation of the rifle. The tourniquet holster includes a rigid housing formed of opposed left and right sidewalls, a rear wall, and a front wall collectively defining a sleeve channel for storing the tourniquet. Protrusion sidewalls extend forwardly from the front wall and taper to a protrusion front wall to collectively define a protrusion area for storing the elongated windlass handle of the tourniquet. The rigid housing is sized to expose a portion of the tourniquet outside forward and rearward openings of the housing to enable a user to readily grip the tourniquet for removal from the holster.
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Patent Agency Ranking
公开(公告)号：US20030074822A1
公开(公告)日：2003-04-24
申请号：US10245057
申请日：2002-09-16
Applicant: First Samco Inc.
Inventor： Tuvia Faifer
IPC: F41C023/00
CPC classification number: F41C23/16 , F41G11/003
Abstract: A forearm handgrip for a rifle, comprising a pair of essentially identical semi-oval mating half-grip pieces adapted to mate together to form the grip. The half-grip pieces have an exterior shaped in a generally semi-oval lateral section having curved sides and adapted to fit a shooter' hand, and are formed of injection-molded high density polymer. At least the bottom, and preferably both, half-grip piece have an accessory mounting rail recessed in the area at the center of the piece such that the posts and guide channel of the rail are inside what would be the extended arc of the sides of the half grip piece. A cover plate is adapted for engagement with each rail to cover the rail when the rail is not in use, the cover plate being shaped to replicate the extended arc of the sides of the half grip up to a flat longitudinally extending rib running along the center of the cover plate. Ventilation holes may be located in a row in the accessory rail and in the cover plate.
Abstract translation: 用于步枪的前臂手柄，包括一对基本上相同的半椭圆形配合半把手部件，其适于配合在一起以形成把手。 半把手片具有外形，形状为大致半椭圆形的横截面，具有弯曲的侧面并且适于装配射手的手，并且由注射成型的高密度聚合物形成。 至少底部，优选地，两个半把手件具有在该件的中心处的区域中凹进的附件安装轨道，使得轨道的柱和引导通道在内侧将是 半夹子。 当不使用轨道时，盖板适于与每个轨道接合以覆盖轨道，盖板被成形为将半把手的侧面的延伸弧复制到沿着中心延伸的平坦的纵向延伸的肋 的盖板。 通风孔可以位于附件轨道和盖板中的一排中。
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6.发明授权公开(公告)号：US11650178B2
公开(公告)日：2023-05-16
申请号：US16770378
申请日：2018-12-10
Applicant: SAMCO INC.
Inventor： Risa Funahashi , Taichi Hashimoto , Hirokazu Terai , Fumina Miyake
IPC: G01N27/327 , B32B15/085 , B32B38/00
CPC classification number: G01N27/327 , B32B15/085 , B32B38/0008
Abstract: A method for bonding a first member having a first bond-target surface made of cycloolefin polymer to a second member having a second bond-target surface made of metal. The method includes a process of exposing the first bond-target surface and the second bond-target surface to at least one of the H2O plasma and O2 plasma, as well as a process of combining the first bond-target surface and the second bond-target surface.
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公开(公告)号：US11633924B2
公开(公告)日：2023-04-25
申请号：US16489326
申请日：2018-02-08
Applicant: SAMCO INC.
Inventor： Hirokazu Terai , Risa Funahashi , Tomoyasu Nishimiya
Abstract: A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.
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公开(公告)号：US09488519B2
公开(公告)日：2016-11-08
申请号：US14730762
申请日：2015-06-04
Applicant: SAMCO INC.
Inventor： Kiyoshi Hasegawa , Hiroshi Kawamura , Peter Wood
CPC classification number: G01J1/0238 , G01J1/4257 , G01N21/55 , G01N2021/8427 , G01N2201/025 , G01N2201/1087
Abstract: The present invention provides a light beam measuring instrument that can securely receive light reflected by a sample. The light beam measuring instrument 1 includes an optical axis tilting mechanism 13 that includes a first tilting mechanism 131 and a second tilting mechanism 132. From the optical axis A1 of irradiation light beam emitted from a light beam source 112, the first tilting mechanism 131 tilts the optical axis A1 about the first tilting axis T1. The second tilting mechanism 132 tilts the optical axis A1 about the second tilting axis T2. The light beam measuring instrument 1 can receive the light reflected by the semiconductor chip C by means of operation of the optical axis tilting mechanism 13 even if the light reflected by the semiconductor chip C is tilted. Accordingly, this apparatus can securely perform measurement or inspection using the light beam.
Abstract translation: 本发明提供了一种可以安全地接收由样品反射的光的光束测量仪器。 光束测量仪1包括光轴倾斜机构13，其包括第一倾斜机构131和第二倾斜机构132.从光束源112发射的照射光束的光轴A1，第一倾斜机构131倾斜 围绕第一倾斜轴线T1的光轴A1。 第二倾斜机构132围绕第二倾斜轴T2倾斜光轴A1。 即使由半导体芯片C反射的光倾斜，光束测量仪器1也可以通过光轴倾斜机构13的操作来接收由半导体芯片C反射的光。 因此，该装置可以可靠地执行使用光束的测量或检查。
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公开(公告)号：US3537134A
公开(公告)日：1970-11-03
申请号：US3537134D
申请日：1967-10-20
Applicant: SAMCO INC
Inventor： RAPER ROBERT D , KINSLY JOHN P
CPC classification number: B29C49/36 , Y10S425/012
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