公开(公告)号：US20130260041A1

公开(公告)日：2013-10-03

申请号：US13852971

申请日：2013-03-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Cheol Kang ,  Jong Hwi Kang ,  Hyun Wook An ,  Suk Gi Hong

IPC: B05D3/12

CPC classification number: B05D3/12 ,  B05B13/0221 ,  B05B14/30 ,  B05C3/10 ,  B05C3/18 ,  B05D1/18 ,  B05D1/42 ,  B05D2252/04 ,  H05K3/0091 ,  H05K2203/0139 ,  H05K2203/1509

Abstract: Disclosed herein is an apparatus for coating a substrate, including a horizontal coating unit having an inlet and an outlet through which a substrate is moving in and out horizontally, and coating surfaces of the substrate with coating liquid by horizontal dipping method to form a protective layer; and a squeegee unit arranged outside the outlet of the horizontal coating unit and being in close contact with the protective layer of the substrate moving out of the horizontal coating unit through the outlet to uniformize coating thickness of the protective layer.According to the present invention, coating thickness of a protective layer coated on a substrate is formed uniformly, and in particular coating quality of edges of the substrate is improved. Therefore, it is possible to minimize foreign substances introduced during manufacturing process of the substrate, thereby reducing defective rate due to foreign substances and improving productivity.

Abstract translation: 本发明公开了一种用于涂布基材的设备，包括具有入口和出口的水平涂布单元，基底通过该入口和出口水平移入和移出，并且通过水平浸渍方法用涂布液涂覆基底的表面以形成保护层 ; 以及设置在水平涂布单元的出口外侧的刮板单元，并且通过出口与基板的保护层紧密接触，从而将其水平涂布单元移出，使保护层的涂层厚度均匀化。 根据本发明，均匀地形成涂覆在基板上的保护层的涂层厚度，特别是提高了基板边缘的涂层质量。 因此，可以使基板的制造过程中引入的异物最小化，从而减少由于异物引起的不良率并提高生产率。