公开(公告)号：US20130134208A1

公开(公告)日：2013-05-30

申请号：US13675235

申请日：2012-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Noriaki MUKAI ,  Hueng Jae OH ,  Dae Young LEE ,  Jin Won CHOI

IPC: B23K3/06

CPC classification number: B23K3/0661 ,  B23K3/0653

Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Abstract translation: 这里公开了一种在衬底上进行焊接工艺的焊料凸点形成装置，该焊料凸点形成装置包括：焊料槽，其中容纳焊料; 搅拌器搅动焊料槽中的焊料; 驱动搅拌器的司机 以及向衬底提供吸力的抽吸压力提供器。