公开(公告)号：US20140175672A1

公开(公告)日：2014-06-26

申请号：US14063699

申请日：2013-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Won CHOI

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L24/80 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/12042 ,  H05K1/183 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09727 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1536 ,  H01L2924/00

Abstract: Provided is a hybrid substrate with high density and low density substrate areas and a method of manufacturing the same. The hybrid substrate with high density and low density substrate areas includes a low density substrate layer having a cavity and a low density area, a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area having a higher pattern density than that of the low density area, an insulating support layer comprising a deposition area formed on upper portions, lower portions and the upper and lower portions of the high density substrate layer and the low density substrate layer, insulating layer vias passing through the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer, and an outer pattern layer.

Abstract translation: 提供了具有高密度和低密度基板区域的混合基板及其制造方法。 具有高密度和低密度衬底区域的混合衬底包括具有空腔和低密度面积的低密度衬底层，安装在低密度衬底层的空腔中的高密度衬底层，并由具有 具有比低密度区域更高的图案密度的绝缘支撑层，包括形成在高密度衬底层的上部，下部和上部和下部的沉积区域和低密度衬底层的绝缘支撑层，绝缘层通孔 绝缘支撑层的沉积区域和与高密度衬底层和低密度衬底层的图案相连，以及外部图案层。

公开(公告)号：US20130134208A1

公开(公告)日：2013-05-30

申请号：US13675235

申请日：2012-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Noriaki MUKAI ,  Hueng Jae OH ,  Dae Young LEE ,  Jin Won CHOI

IPC: B23K3/06

CPC classification number: B23K3/0661 ,  B23K3/0653

Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Abstract translation: 这里公开了一种在衬底上进行焊接工艺的焊料凸点形成装置，该焊料凸点形成装置包括：焊料槽，其中容纳焊料; 搅拌器搅动焊料槽中的焊料; 驱动搅拌器的司机 以及向衬底提供吸力的抽吸压力提供器。

公开(公告)号：US20130134207A1

公开(公告)日：2013-05-30

申请号：US13675227

申请日：2012-11-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Noriaki MUKAI ,  Hueng Jae OH ,  Jin Won CHOI

IPC: B23K3/06

CPC classification number: B23K3/0623 ,  B23K3/082

Abstract: Disclosed herein is a solder bump forming apparatus including: a flux dispenser dispensing a flux to a processing substrate; a solder dispenser dispensing a solder to the processing substrate to which the flux is applied while moving following the flux dispenser; and driver driving the flux dispenser and the solder dispenser.

Abstract translation: 本文公开了一种焊料凸块形成装置，包括：焊剂分配器，其将助熔剂分配到处理衬底; 焊料分配器将焊料分配到处理基板上，随着焊剂分配器移动，焊剂被施加到处理基板; 驱动器驱动助焊剂分配器和焊剂分配器。

公开(公告)号：US20150102488A1

公开(公告)日：2015-04-16

申请号：US14575915

申请日：2014-12-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won CHOI ,  Yon Ho YOU

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L21/76895 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Disclosed herein a printed circuit board comprising: a plurality of pads formed on a substrate; a solder resist (SR) pattern enclosing a region of the pad and burying another circuit pattern; and a solder pattern including a metal pattern therein using a solder and formed on an upper surface of each of the pads.

Abstract translation: 本文公开了一种印刷电路板，包括：形成在基板上的多个焊盘; 阻挡层（SR）图案，其包围焊盘的区域并掩埋另一电路图案; 以及焊料图案，其中使用焊料形成其中的金属图案并形成在每个焊盘的上表面上。

公开(公告)号：US20140291851A1

公开(公告)日：2014-10-02

申请号：US14302045

申请日：2014-06-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Taek LEE ,  Hueng Jae OH ,  Sung Won JEONG ,  Gi Sub LEE ,  Jin Won CHOI

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract translation: 用于封装衬底的引脚包括：连接销插入形成在外部衬底中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

公开(公告)号：US20140138821A1

公开(公告)日：2014-05-22

申请号：US14164908

申请日：2014-01-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hueng Jae OH ,  Tae Joon CHUNG ,  Dong Gyu LEE ,  Seon Jae MUN ,  Jin Won CHOI

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract translation: 这里公开了用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US20140076611A1

公开(公告)日：2014-03-20

申请号：US14022821

申请日：2013-09-10

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Won CHOI ,  Yon Ho YOU

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K3/00 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2201/10234

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括：制备基底; 在基底基板的一个表面上设置具有形成在其中的通孔的掩模; 将金属芯球插入到掩模的通孔中，对金属芯球进行回流处理，并除去掩模; 并且在基底基板的一个表面上层叠绝缘层。