公开(公告)号：US20140042122A1

公开(公告)日：2014-02-13

申请号：US13963907

申请日：2013-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Mok Jung ,  Min Soo Kim ,  Hun June Song ,  Ba Wool Kim

IPC: H05K3/00 ,  H05K3/10

CPC classification number: H05K3/0079 ,  H05K3/0041 ,  H05K3/0082 ,  H05K3/107 ,  H05K3/421 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0594

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, the method including: preparing a base substrate having an insulating layer and a connection pad formed in the insulating layer; forming a photosensitive resist on the insulating layer; forming an opening part of which a side surface has a foot shape by patterning the photosensitive resist; forming a via hole exposing the connection pad by etching the insulating layer exposed by the opening part; and forming a via by filling the via hole.

Abstract translation: 本发明公开了一种制造印刷电路板的方法，该方法包括：制备具有绝缘层的基底和形成在该绝缘层中的连接焊盘; 在绝缘层上形成光敏抗蚀剂; 通过对感光性抗蚀剂进行图案化而形成侧面具有脚形的开口部; 形成通孔，通过蚀刻由所述开口部露出的绝缘层而暴露所述连接焊盘; 以及通过填充通孔形成通孔。