公开(公告)号：US20140291851A1

公开(公告)日：2014-10-02

申请号：US14302045

申请日：2014-06-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Taek LEE ,  Hueng Jae OH ,  Sung Won JEONG ,  Gi Sub LEE ,  Jin Won CHOI

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract translation: 用于封装衬底的引脚包括：连接销插入形成在外部衬底中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。