公开(公告)号：US12125835B2

公开(公告)日：2024-10-22

申请号：US18083619

申请日：2022-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chee-Pin T'Ng ,  Sai-Mun Lee

IPC: H01L25/16 ,  G01J1/02 ,  G01J3/02 ,  G01J3/10 ,  G01S7/481 ,  G01S17/04 ,  H01L25/00

CPC classification number: H01L25/167 ,  G01J1/0214 ,  G01J3/0227 ,  G01J3/0256 ,  G01J3/0262 ,  G01J3/108 ,  G01S7/4813 ,  G01S17/04 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There is provided a module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.