公开(公告)号：US20160234903A1

公开(公告)日：2016-08-11

申请号：US15134597

申请日：2016-04-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-pil NAM ,  Ki-won CHOI

IPC: H05B33/08

CPC classification number: H05B33/0845 ,  F21K9/20 ,  F21K9/232 ,  F21V23/00 ,  H01L33/08 ,  H01L33/382 ,  H05B33/0821 ,  Y02B20/383

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract translation: 发光器件（LED）阵列模块包括至少一个端子，发光器件（LED）阵列和等级存储器件。 LED阵列包括当从LED阵列模块的外部提供电流时发光的多个LED。 等级存储装置被配置为存储取决于LED的亮度特性的LED阵列的等级信息，并且经由至少一个终端输出与等级信息相对应的信号。

公开(公告)号：US20140225517A1

公开(公告)日：2014-08-14

申请号：US14179162

申请日：2014-02-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-pil NAM ,  Ki-won CHOI

IPC: H05B33/08

CPC classification number: H05B33/0845 ,  F21K9/20 ,  F21K9/232 ,  F21V23/00 ,  H01L33/08 ,  H01L33/382 ,  H05B33/0821 ,  Y02B20/383

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract translation: 发光器件（LED）阵列模块包括至少一个端子，发光器件（LED）阵列和等级存储器件。 LED阵列包括当从LED阵列模块的外部提供电流时发光的多个LED。 等级存储装置被配置为存储取决于LED的亮度特性的LED阵列的等级信息，并且经由至少一个终端输出与等级信息相对应的信号。

公开(公告)号：US20140218954A1

公开(公告)日：2014-08-07

申请号：US14094294

申请日：2013-12-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-jeong YOON ,  Ki-won CHOI

IPC: H01L33/62 ,  F21S8/10 ,  F21S2/00

CPC classification number: H01L33/62 ,  F21S41/141 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  H01L2224/48091 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/14 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/046 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: Provided is a light-emitting device package module including a light-emitting device; a first circuit board receiving the light-emitting device, and electrically connected with the light-emitting device; and a second circuit board assembled with the first circuit board by using a connection member, and electrically connected with the first circuit board.

Abstract translation: 提供一种发光器件封装模块，其包括发光器件; 接收所述发光装置的第一电路板，并与所述发光装置电连接; 以及通过使用连接构件与第一电路板组装的第二电路板，并与第一电路板电连接。